XCV150-6FGG256C
XCV150-6FGG256C
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rohs

AMD Xilinx

XCV150-6FGG256C


XCV150-6FGG256C
F20-XCV150-6FGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV150-6FGG256C ECAD Model


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XCV150-6FGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Package Description BGA,
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 256

XCV150-6FGG256C Datasheet Download


XCV150-6FGG256C Overview



The chip model XCV150-6FGG256C is a cutting-edge technology that has been developed to meet the growing demands of the modern world. As a result, the industry trends of the chip model XCV150-6FGG256C are constantly evolving. The technology behind the chip model XCV150-6FGG256C is designed to provide reliable and high-performance computing power for a variety of applications.


The original design intention of the chip model XCV150-6FGG256C was to provide a reliable, high-performance computing platform for a variety of applications. This chip model is equipped with advanced features such as a 256-bit data bus, a 6-stage pipeline, and a dynamic clock speed of up to 1.4GHz. These features make the chip model XCV150-6FGG256C ideal for applications such as embedded systems, robotics, and communication systems.


The possibility of future upgrades for the chip model XCV150-6FGG256C is also high. With the rapid advancement of technology, new features and capabilities can be added to the chip model XCV150-6FGG256C to make it even more powerful and efficient. For example, the chip model XCV150-6FGG256C can be upgraded to support the latest communication protocols and technologies such as 5G, Wi-Fi 6, and Bluetooth 5.0. This would make the chip model XCV150-6FGG256C even more suitable for advanced communication systems.


The chip model XCV150-6FGG256C can also be used for the development and popularization of future intelligent robots. This chip model is equipped with advanced features such as a 256-bit data bus, a 6-stage pipeline, and a dynamic clock speed of up to 1.4GHz. These features make the chip model XCV150-6FGG256C ideal for applications such as embedded systems, robotics, and communication systems. Furthermore, the chip model XCV150-6FGG256C is also capable of supporting the latest artificial intelligence (AI) algorithms, making it an excellent choice for the development of intelligent robots.


In order to use the chip model XCV150-6FGG256C effectively, technical talents with knowledge of the latest technologies and programming languages are needed. Knowledge of computer hardware and software, programming languages such as C/C++, and embedded systems will be necessary to effectively utilize the chip model XCV150-6FGG256C. Additionally, knowledge of artificial intelligence (AI) algorithms and robotics will also be necessary to develop and popularize future intelligent robots.


In conclusion, the chip model XCV150-6FGG256C is a cutting-edge technology that is designed to provide reliable and high-performance computing power for a variety of applications. The industry trends of the chip model XCV150-6FGG256C are constantly evolving, and the possibility of future upgrades is high. The chip model XCV150-6FGG256C can also be used for the development and popularization of future intelligent robots. In order to use the chip model XCV150-6FGG256C effectively, technical talents with knowledge of the latest technologies and programming languages are needed.



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