XCV150-6BGG256I
XCV150-6BGG256I
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rohs

AMD Xilinx

XCV150-6BGG256I


XCV150-6BGG256I
F20-XCV150-6BGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV150-6BGG256I ECAD Model


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XCV150-6BGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV150-6BGG256I Datasheet Download


XCV150-6BGG256I Overview



The chip model XCV150-6BGG256I is a powerful integrated circuit that offers a wide range of advantages for users in the technology industry. It is designed with advanced features that can accommodate the needs of many different applications. It is a highly reliable and efficient chip model that is suitable for a wide range of applications.


The XCV150-6BGG256I chip model is designed with a low-power architecture that helps to reduce energy consumption and improve performance. It also offers a wide range of features that are beneficial for users, such as high-speed data processing, low latency, and low power consumption. These features make the model suitable for a variety of applications, including network applications, intelligent scenarios, and robotic systems.


In terms of network applications, the XCV150-6BGG256I chip model can be used to provide high-speed data transmission and data processing. It can also be used to create intelligent scenarios, such as machine learning and artificial intelligence. This chip model is also suitable for the development and popularization of future intelligent robots. It is capable of providing high-speed data processing, low latency, and low power consumption, which are all essential for the development of intelligent robots.


In terms of the future demand trends for the XCV150-6BGG256I chip model, it is expected to remain in high demand due to its wide range of advantages and features. As the technology industry continues to evolve, the demand for the chip model is likely to increase as more applications are developed that require its capabilities.


In order to use the XCV150-6BGG256I chip model effectively, it is important to have the right technical skills and knowledge. It is also important to have a good understanding of the chip model's features and capabilities in order to be able to use it to its full potential. Technical experts with knowledge of machine learning, artificial intelligence, and robotics are particularly well-suited for using the XCV150-6BGG256I chip model effectively.


Overall, the XCV150-6BGG256I chip model is a powerful integrated circuit that offers a wide range of advantages for users in the technology industry. It is designed with advanced features that can accommodate the needs of many different applications, including network applications, intelligent scenarios, and robotic systems. It is expected to remain in high demand due to its wide range of advantages and features, and technical experts with knowledge of machine learning, artificial intelligence, and robotics are particularly well-suited for using the XCV150-6BGG256I chip model effectively.



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