
AMD Xilinx
XCV150-6BGG256I
XCV150-6BGG256I ECAD Model
XCV150-6BGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 164674 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 164674 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV150-6BGG256I Datasheet Download
XCV150-6BGG256I Overview
The chip model XCV150-6BGG256I is a powerful integrated circuit that offers a wide range of advantages for users in the technology industry. It is designed with advanced features that can accommodate the needs of many different applications. It is a highly reliable and efficient chip model that is suitable for a wide range of applications.
The XCV150-6BGG256I chip model is designed with a low-power architecture that helps to reduce energy consumption and improve performance. It also offers a wide range of features that are beneficial for users, such as high-speed data processing, low latency, and low power consumption. These features make the model suitable for a variety of applications, including network applications, intelligent scenarios, and robotic systems.
In terms of network applications, the XCV150-6BGG256I chip model can be used to provide high-speed data transmission and data processing. It can also be used to create intelligent scenarios, such as machine learning and artificial intelligence. This chip model is also suitable for the development and popularization of future intelligent robots. It is capable of providing high-speed data processing, low latency, and low power consumption, which are all essential for the development of intelligent robots.
In terms of the future demand trends for the XCV150-6BGG256I chip model, it is expected to remain in high demand due to its wide range of advantages and features. As the technology industry continues to evolve, the demand for the chip model is likely to increase as more applications are developed that require its capabilities.
In order to use the XCV150-6BGG256I chip model effectively, it is important to have the right technical skills and knowledge. It is also important to have a good understanding of the chip model's features and capabilities in order to be able to use it to its full potential. Technical experts with knowledge of machine learning, artificial intelligence, and robotics are particularly well-suited for using the XCV150-6BGG256I chip model effectively.
Overall, the XCV150-6BGG256I chip model is a powerful integrated circuit that offers a wide range of advantages for users in the technology industry. It is designed with advanced features that can accommodate the needs of many different applications, including network applications, intelligent scenarios, and robotic systems. It is expected to remain in high demand due to its wide range of advantages and features, and technical experts with knowledge of machine learning, artificial intelligence, and robotics are particularly well-suited for using the XCV150-6BGG256I chip model effectively.
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