AMD Xilinx
XCV150-6BGG256C
XCV150-6BGG256C ECAD Model
XCV150-6BGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-6BGG256C Datasheet Download
XCV150-6BGG256C Overview
The chip model XCV150-6BGG256C is a high-performance, low-power FPGA device designed for a variety of applications. It is a small, low-cost, and highly configurable FPGA device that is ideal for applications requiring high-speed, low-power, and high-density solutions. With its advanced features, the chip model XCV150-6BGG256C is well suited for a variety of applications such as communications, embedded systems, and digital signal processing.
The original design intention of the chip model XCV150-6BGG256C was to provide a low-power, high-performance FPGA device that is capable of meeting the requirements of a variety of applications. It is designed to be used in networks and intelligent systems, providing a high degree of flexibility and scalability. The chip model XCV150-6BGG256C is highly configurable and can be used in a variety of applications, including communication systems, embedded systems, and digital signal processing.
The chip model XCV150-6BGG256C is capable of being upgraded to meet future requirements. It is designed to be highly configurable and can be adapted to meet the needs of different applications. The device can be used in the era of fully intelligent systems, providing a high degree of flexibility and scalability. It is also capable of being used in advanced communication systems, providing a high degree of performance and reliability.
The product description and specific design requirements of the chip model XCV150-6BGG256C are available from the manufacturer. The device is designed to meet the needs of a variety of applications, including communications, embedded systems, and digital signal processing. The device is also capable of being used in advanced communication systems, providing a high degree of performance and reliability.
In order to ensure the successful implementation of the chip model XCV150-6BGG256C, actual case studies and precautions should be taken into consideration. The device should be tested and verified for compatibility with the application it is intended for. In addition, the device should be evaluated for its performance, power consumption, and reliability. Finally, the device should be tested for compatibility with the specific environment in which it will be used.
In conclusion, the chip model XCV150-6BGG256C is a highly configurable and low-power FPGA device designed for a variety of applications. It is designed to meet the needs of a variety of applications, including communication systems, embedded systems, and digital signal processing. The device is capable of being upgraded to meet future requirements and can be used in the era of fully intelligent systems. It is also capable of being used in advanced communication systems, providing a high degree of performance and reliability. Actual case studies and precautions should be taken into consideration in order to ensure the successful implementation of the chip model XCV150-6BGG256C.
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