AMD Xilinx
XCV150-6BG352I
XCV150-6BG352I ECAD Model
XCV150-6BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 3888 | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-6BG352I Datasheet Download
XCV150-6BG352I Overview
The XCV150-6BG352I chip model is a powerful and versatile digital signal processor (DSP) designed to meet the needs of a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other sophisticated tasks. It is capable of handling complex calculations and data processing tasks with ease and efficiency.
The original design intention of the XCV150-6BG352I chip model was to provide a powerful, yet cost-effective solution for a variety of applications. It is designed for scalability, so that it can be upgraded with the latest technologies to keep up with the ever-evolving needs of the industry. It is also designed to be used with the HDL language, which allows for easy and efficient programming of the processor.
The XCV150-6BG352I chip model has the potential to be used in advanced communication systems, such as 5G networks, and in the era of fully intelligent systems. It is capable of handling complex calculations and data processing tasks with ease and efficiency, making it an ideal choice for applications such as artificial intelligence, machine learning, and autonomous vehicles. It is also capable of being used in a variety of intelligent scenarios, such as facial recognition and image processing.
The XCV150-6BG352I chip model is a powerful and versatile processor that is capable of meeting the needs of a variety of applications. Its scalability and ability to be used with the HDL language makes it a great choice for a wide range of uses. Its potential to be used in advanced communication systems and in intelligent scenarios makes it an ideal choice for the future.
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1,934 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $53.5680 | $53.5680 |
| 10+ | $52.9920 | $529.9200 |
| 100+ | $50.1120 | $5,011.2000 |
| 1000+ | $47.2320 | $23,616.0000 |
| 10000+ | $43.2000 | $43,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||