AMD Xilinx
XCV150-5FGG456I
XCV150-5FGG456I ECAD Model
XCV150-5FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-5FGG456I Datasheet Download
XCV150-5FGG456I Overview
The chip model XCV150-5FGG456I is a highly advanced integrated circuit that is suitable for a range of applications such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language to program and operate the chip, making it an ideal choice for applications that require a high degree of precision and reliability.
The industry trends of the chip model XCV150-5FGG456I are heavily dependent on the specific technologies that are needed for the application environment. As new technologies continue to emerge, it is likely that the chip model XCV150-5FGG456I will need to be upgraded in order to remain competitive in the market.
The original design intention of the chip model XCV150-5FGG456I was to provide a reliable and powerful integrated circuit that could be used in a range of applications. The chip is highly versatile, and can be easily upgraded to take advantage of new technologies. This makes it an ideal choice for advanced communication systems that require the use of cutting-edge technology.
In conclusion, the chip model XCV150-5FGG456I is a highly advanced integrated circuit that can be used in a range of applications. It requires the use of HDL language for programming and operation, and can be easily upgraded to take advantage of new technologies. This makes it an ideal choice for high-performance digital signal processing, embedded processing, image processing, and advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||