AMD Xilinx
XCV150-5FGG456C
XCV150-5FGG456C ECAD Model
XCV150-5FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-5FGG456C Datasheet Download
XCV150-5FGG456C Overview
The XCV150-5FGG456C chip model is a powerful and versatile tool for modern applications. It is designed to meet the needs of the most demanding applications, including networks, intelligent scenarios, and fully intelligent systems. This chip model is capable of providing the highest level of performance, reliability, and security.
The XCV150-5FGG456C chip model is designed to meet the requirements of the latest industry trends and the future development of related industries. It is designed with advanced technologies such as a powerful processor, an advanced memory architecture, and advanced security features. This chip model is capable of providing the highest level of performance and reliability for the most demanding applications.
The XCV150-5FGG456C chip model is specifically designed to meet the needs of networks and intelligent scenarios. It is capable of providing the highest level of performance and reliability for network applications, as well as for intelligent scenarios. This chip model is also capable of providing the highest level of security for applications, ensuring that the data is secure and protected from unauthorized access.
The product description and specific design requirements of the XCV150-5FGG456C chip model are detailed and comprehensive. This chip model is designed to meet the needs of a wide range of applications, including networks, intelligent scenarios, and fully intelligent systems. This chip model is capable of providing the highest level of performance, reliability, and security.
The XCV150-5FGG456C chip model has been tested and verified in actual case studies. This chip model is capable of providing the highest level of performance and reliability for the most demanding applications. In addition, this chip model is also capable of providing the highest level of security for applications, ensuring that the data is secure and protected from unauthorized access.
When using the XCV150-5FGG456C chip model, it is important to follow the recommended precautions. This chip model is designed to meet the needs of the most demanding applications, and it is important to ensure that the chip model is used in the correct manner. It is also important to ensure that the chip model is used in accordance with the manufacturer's instructions.
In conclusion, the XCV150-5FGG456C chip model is a powerful and versatile tool for modern applications. It is designed to meet the needs of the most demanding applications, including networks, intelligent scenarios, and fully intelligent systems. This chip model is capable of providing the highest level of performance, reliability, and security. It is important to follow the recommended precautions when using the chip model, and to ensure that the chip model is used in accordance with the manufacturer's instructions.
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