AMD Xilinx
XCV150-5FGG256C
XCV150-5FGG256C ECAD Model
XCV150-5FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-5FGG256C Datasheet Download
XCV150-5FGG256C Overview
The chip model XCV150-5FGG256C is a revolutionary product in the chip industry. Developed by Xilinx, it has been widely used in various industries, such as communications, transportation, aerospace, and medical. It is an advanced, high-performance and low-power FPGA device, which is capable of providing high-speed and low-latency operations.
The XCV150-5FGG256C is a single-chip solution with an integrated memory, which can be used in a wide range of applications, including data processing, embedded systems, and digital signal processing. It is also suitable for high-speed data transfer, and can be used in high-speed communication systems, such as 4G and 5G networks.
The XCV150-5FGG256C is designed with a low-power, high-performance architecture, allowing for a wide range of applications, such as high-speed data processing and communications. It also has a high-speed memory interface, allowing for fast data transfer, and a flexible programmable logic, allowing for easy customization of the chip.
The XCV150-5FGG256C is also designed with an advanced power management system, allowing for efficient power consumption. This makes it suitable for applications that require low-power operation, such as mobile devices and embedded systems.
The XCV150-5FGG256C is designed to be easily upgradable, allowing for new features and capabilities to be added. This makes it suitable for applications that require the latest technology, such as advanced communication systems.
The chip model XCV150-5FGG256C is expected to be in high demand in the future, as more and more industries rely on it for their operations. Its low-power, high-performance architecture and upgradability make it suitable for a wide range of applications, and it is expected to be a key player in the chip industry in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||