XCV150-5FG456C
XCV150-5FG456C
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AMD Xilinx

XCV150-5FG456C


XCV150-5FG456C
F20-XCV150-5FG456C
Active
IC FPGA 260 I/O 456FBGA
456-FBGA (23x23)

XCV150-5FG456C ECAD Model


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XCV150-5FG456C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 864
Number of Logic Elements/Cells 3888
Total RAM Bits 49152
Number of I/O 260
Number of Gates 164674
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XCV150

XCV150-5FG456C Datasheet Download


XCV150-5FG456C Overview



The XCV150-5FG456C is a field programmable gate array (FPGA) chip from Xilinx. It is part of the Virtex-5 family of FPGAs and is designed for high-end applications that require performance, flexibility and scalability. It is made up of over 1.5 million logic cells, including over 5,000 DSP slices and over 1,000 block RAMs. It also contains over 300 18x18 multipliers and over 200 I/O pins.


The XCV150-5FG456C is designed to provide high-speed performance and efficient power consumption. It has a maximum clock frequency of 533 MHz and a power dissipation of 10W. It has a wide range of I/O standards, including LVDS, SSTL, LVPECL, HSTL, GTL and PCI Express. It is also compatible with a variety of development tools, such as the Xilinx ISE and Xilinx Platform Studio.


The XCV150-5FG456C is suitable for a wide range of applications, such as embedded computing, telecommunications, networking, medical imaging, high-performance computing, military and aerospace applications. It can be used for applications that require high-speed data processing, low-power operation and high-density integration.


In summary, the XCV150-5FG456C is a high-performance, low-power FPGA chip from Xilinx. It is designed for high-end applications that require performance, flexibility and scalability. It has a wide range of I/O standards and is suitable for a variety of applications, including embedded computing, telecommunications, networking, medical imaging, high-performance computing, military and aerospace applications.



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