
AMD Xilinx
XCV150-5FG456C
XCV150-5FG456C ECAD Model
XCV150-5FG456C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 864 | |
Number of Logic Elements/Cells | 3888 | |
Total RAM Bits | 49152 | |
Number of I/O | 260 | |
Number of Gates | 164674 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 456-BBGA | |
Supplier Device Package | 456-FBGA (23x23) | |
Base Product Number | XCV150 |
XCV150-5FG456C Datasheet Download
XCV150-5FG456C Overview
The XCV150-5FG456C is a field programmable gate array (FPGA) chip from Xilinx. It is part of the Virtex-5 family of FPGAs and is designed for high-end applications that require performance, flexibility and scalability. It is made up of over 1.5 million logic cells, including over 5,000 DSP slices and over 1,000 block RAMs. It also contains over 300 18x18 multipliers and over 200 I/O pins.
The XCV150-5FG456C is designed to provide high-speed performance and efficient power consumption. It has a maximum clock frequency of 533 MHz and a power dissipation of 10W. It has a wide range of I/O standards, including LVDS, SSTL, LVPECL, HSTL, GTL and PCI Express. It is also compatible with a variety of development tools, such as the Xilinx ISE and Xilinx Platform Studio.
The XCV150-5FG456C is suitable for a wide range of applications, such as embedded computing, telecommunications, networking, medical imaging, high-performance computing, military and aerospace applications. It can be used for applications that require high-speed data processing, low-power operation and high-density integration.
In summary, the XCV150-5FG456C is a high-performance, low-power FPGA chip from Xilinx. It is designed for high-end applications that require performance, flexibility and scalability. It has a wide range of I/O standards and is suitable for a variety of applications, including embedded computing, telecommunications, networking, medical imaging, high-performance computing, military and aerospace applications.
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