
AMD Xilinx
XCV150-5BGG352I
XCV150-5BGG352I ECAD Model
XCV150-5BGG352I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 164674 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 164674 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 352 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV150-5BGG352I Datasheet Download
XCV150-5BGG352I Overview
The XCV150-5BGG352I chip model is a revolutionary product designed to provide increased performance and improved functionality for advanced communication systems. Developed by Xilinx, this model is based on the Virtex-5 FPGA (Field Programmable Gate Array) technology and is intended to be an upgradeable solution for modern communication systems.
The XCV150-5BGG352I chip model is capable of handling a wide range of tasks in the field of advanced communications. It can be used to improve the performance of networks, enabling them to process large amounts of data quickly and efficiently. Furthermore, the model has the potential to be applied to intelligent scenarios, such as the development of autonomous robots or the implementation of artificial intelligence.
In terms of the potential applications of the XCV150-5BGG352I chip model, it could be used to develop and popularize future intelligent robots. This would require a certain level of technical expertise, as the model is capable of handling complex tasks. However, with the right training and support, the model could be used to create robots that are capable of performing a variety of tasks autonomously.
The XCV150-5BGG352I chip model is an impressive example of modern technology and its potential applications in the field of advanced communications. It is capable of handling a wide range of tasks, from networking to intelligent scenarios, and is an upgradeable solution for modern communication systems. With the right training and support, the model could be used to create robots that are capable of performing a variety of tasks autonomously, making it an invaluable tool in the development and popularization of future intelligent robots.
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