
AMD Xilinx
XCV150-5BG256C
XCV150-5BG256C ECAD Model
XCV150-5BG256C Attributes
Type | Description | Select |
---|---|---|
Mfr | AMD Xilinx | |
Series | Virtex® | |
Package | Tray | |
Number of LABs/CLBs | 864 | |
Number of Logic Elements/Cells | 3888 | |
Total RAM Bits | 49152 | |
Number of I/O | 180 | |
Number of Gates | 164674 | |
Voltage - Supply | 2.375V ~ 2.625V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C (TJ) | |
Package / Case | 256-BBGA | |
Supplier Device Package | 256-PBGA (27x27) | |
Base Product Number | XCV150 |
XCV150-5BG256C Datasheet Download
XCV150-5BG256C Overview
The XCV150-5BG256C is a Field Programmable Gate Array (FPGA) chip model manufactured by Xilinx. It is a 5th generation device in the Virtex family of FPGAs and is based on the Virtex-5 architecture. It features a total of 256K logic cells, 1.2Mb of RAM, and an array of digital signal processing (DSP) blocks. The device is capable of operating at a speed of up to 400MHz and is well suited for applications requiring high performance, low power consumption and a wide range of I/O options.
The chip is housed in a 256-pin BGA package and measures 17.5mm x 17.5mm. It has a power dissipation rating of 12W and is designed to operate in temperatures ranging from -40°C to +85°C. The device supports a wide range of I/O standards, including LVDS, LVCMOS, SSTL, and HSTL. It also supports various memory interfaces, such as DDR2, DDR3, and QDR.
The XCV150-5BG256C is ideal for a wide range of applications, including communications, networking, medical imaging, industrial automation, and military/aerospace. It is particularly well suited for applications requiring high speed and low power consumption, such as video processing, image processing, and high-performance computing. It is also suitable for applications requiring a wide range of I/O options, such as data acquisition, data storage, and control systems.
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