AMD Xilinx
XCV150-4FGG456I
XCV150-4FGG456I ECAD Model
XCV150-4FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-4FGG456I Datasheet Download
XCV150-4FGG456I Overview
The chip model XCV150-4FGG456I has been gaining a lot of attention in recent times due to its potential to revolutionize the industry. Developed by the renowned chip manufacturer XCV, this model is a multi-functional, low-cost, and highly efficient chip that is capable of performing a variety of tasks.
The XCV150-4FGG456I is the latest in a series of chips developed by XCV that are capable of providing a range of features and functions. This chip model offers an impressive range of features, including high-speed processing, increased memory capacity, improved power efficiency, and support for a variety of programming languages. As a result, this chip model has become a popular choice for a variety of applications, including industrial automation, robotics, and smart home devices.
The XCV150-4FGG456I is expected to be in high demand in the future, as the demand for intelligent and automated solutions continues to increase. This chip model is ideal for applications that require a high level of performance, as well as those that require a low cost of ownership. As a result, the XCV150-4FGG456I is expected to be an important component in the development and popularization of future intelligent robots.
In order to effectively use the XCV150-4FGG456I, it is necessary to have a good understanding of the various technologies that are necessary for the application environment. This includes knowledge of programming languages, hardware architecture, and software development tools. Additionally, knowledge of artificial intelligence and machine learning algorithms is also necessary in order to use the chip model to its fullest potential.
In conclusion, the XCV150-4FGG456I is a highly efficient and low-cost chip model that is expected to be in high demand in the future. The chip model is ideal for a variety of applications, including industrial automation, robotics, and smart home devices. In order to effectively use the XCV150-4FGG456I, it is necessary to have a good understanding of the various technologies that are necessary for the application environment. With the right knowledge and expertise, the XCV150-4FGG456I can be used to its fullest potential, making it an important component in the development and popularization of future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||