XCV150-4FGG456C
XCV150-4FGG456C
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rohs

AMD Xilinx

XCV150-4FGG456C


XCV150-4FGG456C
F20-XCV150-4FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV150-4FGG456C ECAD Model


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XCV150-4FGG456C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 456
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV150-4FGG456C Datasheet Download


XCV150-4FGG456C Overview



The chip model XCV150-4FGG456C is a new development in the technology industry and has been gaining traction in recent years. It is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation. With its advanced features and capabilities, it has become one of the most popular models in the industry.


The chip model XCV150-4FGG456C has many advantages over other models. It is capable of performing high-speed calculations and processing large amounts of data. It has a low power consumption, making it an ideal choice for applications that require long-term operation. Furthermore, the model is designed to be highly reliable and durable, ensuring that it can be used in harsh environments without any issues.


In terms of industry trends, the chip model XCV150-4FGG456C is expected to become even more popular in the future. As the demand for automation and intelligent robots increases, the model will be in high demand for its performance and reliability. Furthermore, the model is expected to be used in a wide variety of applications, from consumer electronics to industrial automation.


In terms of the application environment, the chip model XCV150-4FGG456C can be used for the development and popularization of future intelligent robots. The model is capable of performing complex calculations and processing large amounts of data, making it an ideal choice for robotics applications. Furthermore, the model is designed to be highly reliable and durable, ensuring that it can be used in harsh environments without any issues.


In order to use the chip model XCV150-4FGG456C effectively, certain technical talents are needed. This includes knowledge of programming languages, such as C++ and Java, as well as knowledge of robotics and automation. Furthermore, knowledge of machine learning algorithms and artificial intelligence technologies is also necessary to be able to use the model effectively.


Overall, the chip model XCV150-4FGG456C is a powerful and reliable model that can be used in a wide variety of applications. It is expected to become even more popular in the future, as the demand for automation and intelligent robots increases. Furthermore, the model is capable of performing complex calculations and processing large amounts of data, making it an ideal choice for robotics applications. In order to use the model effectively, certain technical talents are needed, such as knowledge of programming languages, robotics, and automation. With these skills, the chip model XCV150-4FGG456C can be used to create powerful and reliable intelligent robots.



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