
AMD Xilinx
XCV150-4FGG256I
XCV150-4FGG256I ECAD Model
XCV150-4FGG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 164674 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 164674 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV150-4FGG256I Datasheet Download
XCV150-4FGG256I Overview
The chip model XCV150-4FGG256I is a cutting-edge technology developed by a leading semiconductor manufacturer. It is designed to provide the highest performance, reliability, and power efficiency for a wide range of applications. The chip model XCV150-4FGG256I is an integrated circuit that combines the latest advances in digital signal processing, memory, and communication technologies. It is a powerful and versatile solution for a wide range of applications, such as advanced communication systems, consumer electronics, industrial automation, and automotive applications.
The chip model XCV150-4FGG256I offers several advantages over other models. Its low power consumption and high performance make it an ideal choice for a wide range of applications. Its small size and low cost make it an attractive option for many applications. Additionally, its high integration level ensures that all components are tightly integrated and easy to use.
The chip model XCV150-4FGG256I is also designed to be highly reliable, with a long life cycle and a low failure rate. This makes it an ideal choice for mission-critical applications. It also offers a wide range of features, such as high-speed data transfer, low latency, and low power consumption.
The chip model XCV150-4FGG256I is expected to be in high demand in the future, as it is designed to meet the changing needs of the industry. It is well suited for applications that require high performance, reliability, and power efficiency. Additionally, its small size and low cost make it an attractive option for many applications. As the demand for advanced communication systems continues to grow, the chip model XCV150-4FGG256I is expected to be in high demand.
The chip model XCV150-4FGG256I is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for applications that require new technologies or features. Additionally, its high integration level ensures that all components are tightly integrated and easy to use. This makes it an attractive option for advanced communication systems, as it can be easily upgraded to meet the changing needs of the industry.
In conclusion, the chip model XCV150-4FGG256I is a cutting-edge technology developed by a leading semiconductor manufacturer. It offers several advantages over other models, including low power consumption, high performance, and high reliability. Additionally, its small size and low cost make it an attractive option for many applications. Furthermore, its high integration level ensures that all components are tightly integrated and easy to use. Finally, its upgradability makes it an ideal choice for applications that require new technologies or features. As the demand for advanced communication systems continues to grow, the chip model XCV150-4FGG256I is expected to be in high demand in the future.
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