XCV150-4FGG256I
XCV150-4FGG256I
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rohs

AMD Xilinx

XCV150-4FGG256I


XCV150-4FGG256I
F20-XCV150-4FGG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV150-4FGG256I ECAD Model


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XCV150-4FGG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV150-4FGG256I Datasheet Download


XCV150-4FGG256I Overview



The chip model XCV150-4FGG256I is a cutting-edge technology developed by a leading semiconductor manufacturer. It is designed to provide the highest performance, reliability, and power efficiency for a wide range of applications. The chip model XCV150-4FGG256I is an integrated circuit that combines the latest advances in digital signal processing, memory, and communication technologies. It is a powerful and versatile solution for a wide range of applications, such as advanced communication systems, consumer electronics, industrial automation, and automotive applications.


The chip model XCV150-4FGG256I offers several advantages over other models. Its low power consumption and high performance make it an ideal choice for a wide range of applications. Its small size and low cost make it an attractive option for many applications. Additionally, its high integration level ensures that all components are tightly integrated and easy to use.


The chip model XCV150-4FGG256I is also designed to be highly reliable, with a long life cycle and a low failure rate. This makes it an ideal choice for mission-critical applications. It also offers a wide range of features, such as high-speed data transfer, low latency, and low power consumption.


The chip model XCV150-4FGG256I is expected to be in high demand in the future, as it is designed to meet the changing needs of the industry. It is well suited for applications that require high performance, reliability, and power efficiency. Additionally, its small size and low cost make it an attractive option for many applications. As the demand for advanced communication systems continues to grow, the chip model XCV150-4FGG256I is expected to be in high demand.


The chip model XCV150-4FGG256I is designed to be highly upgradable, allowing for future upgrades and improvements. This makes it an ideal choice for applications that require new technologies or features. Additionally, its high integration level ensures that all components are tightly integrated and easy to use. This makes it an attractive option for advanced communication systems, as it can be easily upgraded to meet the changing needs of the industry.


In conclusion, the chip model XCV150-4FGG256I is a cutting-edge technology developed by a leading semiconductor manufacturer. It offers several advantages over other models, including low power consumption, high performance, and high reliability. Additionally, its small size and low cost make it an attractive option for many applications. Furthermore, its high integration level ensures that all components are tightly integrated and easy to use. Finally, its upgradability makes it an ideal choice for applications that require new technologies or features. As the demand for advanced communication systems continues to grow, the chip model XCV150-4FGG256I is expected to be in high demand in the future.



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