AMD Xilinx
XCV150-4FGG256C
XCV150-4FGG256C ECAD Model
XCV150-4FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-4FGG256C Datasheet Download
XCV150-4FGG256C Overview
The XCV150-4FGG256C chip model is a highly advanced semiconductor device that has been designed to meet the needs of many different industries. It is a versatile and powerful device that can be used in a variety of applications, including communication systems, robotics, and other complex tasks.
The XCV150-4FGG256C chip model has many advantages over its competitors. It is designed with a 256-bit architecture, allowing for faster processing speeds and more efficient data storage. It also has a low power consumption, making it ideal for use in battery-powered devices. Additionally, it is highly reliable and has a long lifespan, meaning that it can be used for a variety of applications without needing to be replaced.
The XCV150-4FGG256C chip model is expected to be in high demand in the future, as more industries look to take advantage of its advanced features. It is likely to be used in communication systems, as it is capable of providing fast and reliable data transfer and storage. Additionally, it is likely to be used in the development and popularization of intelligent robots, as it has the capability to process complex tasks quickly and accurately.
The XCV150-4FGG256C chip model is highly upgradeable, and can be used in many different types of applications. It is also capable of being used in advanced communication systems, allowing for faster and more reliable data transfer. It is also capable of being used in the development and popularization of intelligent robots, allowing for more advanced robotics capabilities.
In order to effectively use the XCV150-4FGG256C chip model, certain technical skills and knowledge are needed. It requires a good understanding of the underlying architecture and how to program it for various tasks. Additionally, it requires knowledge of the various communication protocols and how to use them in order to transfer data between devices. Finally, it requires an understanding of the various robotics technologies and how to use them to create intelligent robots.
In conclusion, the XCV150-4FGG256C chip model is a highly advanced and versatile device that can be used in many different industries. It has a number of advantages over its competitors, and is expected to be in high demand in the future. Additionally, it is highly upgradeable and can be used in advanced communication systems and the development and popularization of intelligent robots. In order to effectively use the XCV150-4FGG256C chip model, certain technical skills and knowledge are needed.
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|---|---|---|
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