AMD Xilinx
XCV150-4BGG352I
XCV150-4BGG352I ECAD Model
XCV150-4BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 352 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-4BGG352I Datasheet Download
XCV150-4BGG352I Overview
The chip model XCV150-4BGG352I is a powerful integrated circuit (IC) designed to meet the needs of a wide range of applications. It is a 4-bit, 32-pin device that can be used in a variety of settings, including communications, data processing, and consumer electronics. It is a highly efficient and reliable device that can be used in a variety of applications.
The chip model XCV150-4BGG352I is designed with the latest technology and offers a wide range of features and capabilities. It is designed to be highly efficient and reliable, and is capable of supporting a variety of applications. It is also capable of providing high speeds and low power consumption. In addition, it is designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee.
The chip model XCV150-4BGG352I is designed to be highly reliable and is capable of supporting a variety of applications, including communications, data processing, and consumer electronics. It is also designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, it is designed to be compatible with a variety of intelligent systems, including artificial intelligence, machine learning, and deep learning.
The chip model XCV150-4BGG352I is designed to be highly reliable and is capable of supporting a variety of applications, including communications, data processing, and consumer electronics. It is also designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, it is designed to be compatible with a variety of intelligent systems, including artificial intelligence, machine learning, and deep learning. With these features, it is possible to use the chip model XCV150-4BGG352I in a variety of networks and intelligent scenarios.
The chip model XCV150-4BGG352I is designed to be highly efficient and reliable, and is capable of supporting a variety of applications. It is also designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, it is designed to be compatible with a variety of intelligent systems, including artificial intelligence, machine learning, and deep learning. With these features, it is possible to use the chip model XCV150-4BGG352I in a variety of networks and intelligent scenarios.
The chip model XCV150-4BGG352I is designed with the latest technology and offers a wide range of features and capabilities. It is designed to be highly efficient and reliable, and is capable of supporting a variety of applications. It is also capable of providing high speeds and low power consumption. In addition, it is designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. With these features, the chip model XCV150-4BGG352I can be used in a variety of settings, including communications, data processing, and consumer electronics.
The chip model XCV150-4BGG352I is designed to be highly reliable and is capable of supporting a variety of applications, including communications, data processing, and consumer electronics. It is also designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, it is designed to be compatible with a variety of intelligent systems, including artificial intelligence, machine learning, and deep learning. With these features, it is possible to use the chip model XCV150-4BGG352I in a variety of networks and intelligent scenarios in the future.
The chip model XCV150-4BGG352I is designed to meet the needs of a wide range of applications and can be used in a variety of settings. It is designed to be highly efficient and reliable, and is capable of supporting a variety of applications. It is also designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. In addition, it is designed to be compatible with a variety of intelligent systems, including artificial intelligence, machine learning, and deep learning. With these features, the chip model XCV150-4BGG352I can be used in a variety of networks and intelligent scenarios in the future.
In summary, the chip model XCV150-4BGG352I is a powerful integrated circuit (IC) designed to meet the needs of a wide range of applications. It is a 4-bit, 32-pin device that can be used in a variety of settings, including communications, data processing, and consumer electronics. It is designed to be highly efficient and reliable, and is capable of supporting a variety of applications. It is also capable of providing high speeds and low power consumption. In addition, it is designed to be compatible with a variety of communication protocols, including Wi-Fi, Bluetooth, and Zigbee. It is also designed to be
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