AMD Xilinx
XCV150-4BGG256I
XCV150-4BGG256I ECAD Model
XCV150-4BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 164674 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 164674 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV150-4BGG256I Datasheet Download
XCV150-4BGG256I Overview
The XCV150-4BGG256I chip model is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It has many features that make it attractive to developers looking for a powerful, efficient solution for their projects. This chip model is capable of handling sophisticated algorithms and is capable of implementing complex mathematical operations in real-time.
The XCV150-4BGG256I chip model is equipped with a 256-bit instruction set, allowing developers to efficiently program the chip using the hardware description language (HDL). This language is often used for developing embedded systems and is a great choice for those looking to create complex digital systems. The XCV150-4BGG256I chip model also features an on-chip memory controller, allowing developers to easily access and store data.
The XCV150-4BGG256I chip model is an ideal choice for those looking to develop high-performance embedded systems. It is also suitable for applications such as image processing, machine learning, and artificial intelligence. The chip model is expected to become increasingly popular in the coming years as more developers look to take advantage of its features.
The XCV150-4BGG256I chip model can be used to develop and popularize future intelligent robots. However, it requires a certain level of technical expertise to use the chip model effectively. Those who are looking to use the chip model to develop robots must be familiar with the hardware description language, as well as have a good understanding of the chip model's features and capabilities. Additionally, those who are interested in developing robots must have a good understanding of the algorithms and mathematics needed to program the robot.
In conclusion, the XCV150-4BGG256I chip model is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is expected to become increasingly popular in the coming years as more developers look to take advantage of its features. The chip model can be used to develop and popularize future intelligent robots, but requires a certain level of technical expertise to use the chip model effectively.
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