XCV150-4BGG256C
XCV150-4BGG256C
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rohs

AMD Xilinx

XCV150-4BGG256C


XCV150-4BGG256C
F20-XCV150-4BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV150-4BGG256C ECAD Model


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XCV150-4BGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 164674
Number of CLBs 864
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 164674 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description BGA,
Pin Count 256

XCV150-4BGG256C Datasheet Download


XCV150-4BGG256C Overview



The chip model XCV150-4BGG256C is a powerful and versatile semiconductor device that has been used in many applications over the years. It is designed to provide high-speed connectivity and storage capabilities, making it ideal for a wide range of applications. As technology advances, so do the capabilities of the model XCV150-4BGG256C. It is capable of supporting the latest communication systems, and can be used in the development and popularization of future intelligent robots.


To understand the industry trends of the chip model XCV150-4BGG256C and the future development of related industries, it is important to understand the original design intention of the model. The model was designed to provide users with a reliable and efficient solution for their data storage and connectivity needs. It is capable of supporting a wide range of communication protocols and can be used in a variety of applications. Additionally, the model has the potential to be upgraded and improved upon to meet the changing needs of the industry.


When considering the application environment and whether the model requires support from new technologies, it is important to consider the specific technologies that are needed. For example, the model may need to be capable of supporting new communication protocols or may require additional storage capacity. Additionally, the model may need to be able to support the development and popularization of future intelligent robots, which may require specific software or hardware capabilities.


In order to effectively use the chip model XCV150-4BGG256C, it is important to have the right technical talent. Professionals with experience in semiconductor design and development, as well as those with knowledge of communication protocols and robotics, are essential to ensure that the model is used to its full potential. Additionally, those with experience in the development and popularization of intelligent robots are also necessary to make sure that the model is used in the most effective way.


In conclusion, the chip model XCV150-4BGG256C is a powerful and versatile semiconductor device that has been used in many applications over the years. To understand the industry trends of the chip model and the future development of related industries, it is important to consider the original design intention of the model, as well as the specific technologies that are needed. Additionally, those with the right technical talent are necessary to ensure that the model is used to its full potential.



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