
AMD Xilinx
XCV150-4BGG256C
XCV150-4BGG256C ECAD Model
XCV150-4BGG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 164674 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 164674 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.55 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 256 |
XCV150-4BGG256C Datasheet Download
XCV150-4BGG256C Overview
The chip model XCV150-4BGG256C is a powerful and versatile semiconductor device that has been used in many applications over the years. It is designed to provide high-speed connectivity and storage capabilities, making it ideal for a wide range of applications. As technology advances, so do the capabilities of the model XCV150-4BGG256C. It is capable of supporting the latest communication systems, and can be used in the development and popularization of future intelligent robots.
To understand the industry trends of the chip model XCV150-4BGG256C and the future development of related industries, it is important to understand the original design intention of the model. The model was designed to provide users with a reliable and efficient solution for their data storage and connectivity needs. It is capable of supporting a wide range of communication protocols and can be used in a variety of applications. Additionally, the model has the potential to be upgraded and improved upon to meet the changing needs of the industry.
When considering the application environment and whether the model requires support from new technologies, it is important to consider the specific technologies that are needed. For example, the model may need to be capable of supporting new communication protocols or may require additional storage capacity. Additionally, the model may need to be able to support the development and popularization of future intelligent robots, which may require specific software or hardware capabilities.
In order to effectively use the chip model XCV150-4BGG256C, it is important to have the right technical talent. Professionals with experience in semiconductor design and development, as well as those with knowledge of communication protocols and robotics, are essential to ensure that the model is used to its full potential. Additionally, those with experience in the development and popularization of intelligent robots are also necessary to make sure that the model is used in the most effective way.
In conclusion, the chip model XCV150-4BGG256C is a powerful and versatile semiconductor device that has been used in many applications over the years. To understand the industry trends of the chip model and the future development of related industries, it is important to consider the original design intention of the model, as well as the specific technologies that are needed. Additionally, those with the right technical talent are necessary to ensure that the model is used to its full potential.
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