XCV150-4BG256C
XCV150-4BG256C
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AMD Xilinx

XCV150-4BG256C


XCV150-4BG256C
F20-XCV150-4BG256C
Active
IC FPGA 180 I/O 256BGA
256-PBGA (27x27)

XCV150-4BG256C ECAD Model


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XCV150-4BG256C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®
Package Tray
Number of LABs/CLBs 864
Number of Logic Elements/Cells 3888
Total RAM Bits 49152
Number of I/O 180
Number of Gates 164674
Voltage - Supply 2.375V ~ 2.625V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-BBGA
Supplier Device Package 256-PBGA (27x27)
Base Product Number XCV150

XCV150-4BG256C Datasheet Download


XCV150-4BG256C Overview



The XCV150-4BG256C is a Field Programmable Gate Array (FPGA) chip manufactured by Xilinx. It is a mid-range chip, featuring 256 logic cells, 4 Block RAMs and 4 DSP slices. It is based on the Virtex-4 architecture, and supports a range of I/O standards such as LVDS, LVPECL, SSTL, HSTL, and GTL.


The XCV150-4BG256C operates at a maximum frequency of 250 MHz, and has a power consumption of 3.3V. It is available in a range of packages, including a 6.8mm x 6.8mm, 0.5mm pitch BGA package, making it suitable for space-constrained applications.


The XCV150-4BG256C is designed for a range of applications, including industrial automation, medical equipment, automotive, aerospace, and defense. It can be used to implement complex logic functions, and is suitable for high-speed signal processing and control applications. It is also suitable for high-performance embedded systems, as it is capable of handling large amounts of data quickly.


In summary, the XCV150-4BG256C is a mid-range FPGA chip manufactured by Xilinx, featuring 256 logic cells, 4 Block RAMs and 4 DSP slices. It is suitable for a range of applications, including industrial automation, medical equipment, automotive, aerospace, and defense, and is capable of handling large amounts of data quickly.



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