AMD Xilinx
XCV100E-8BGG352C
XCV100E-8BGG352C ECAD Model
XCV100E-8BGG352C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV100E-8BGG352C Datasheet Download
XCV100E-8BGG352C Overview
The XCV100E-8BGG352C chip model is a high-performance, low-power device designed for digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip model is an ideal choice for applications that require high performance and low power consumption.
The XCV100E-8BGG352C is designed to meet the needs of a wide range of applications, from consumer electronics to industrial automation. It has been designed to provide high performance and power efficiency, as well as to meet the requirements of advanced communication systems. The original design intention of the chip model was to provide a high-performance, low-power solution for applications that require the use of HDL language.
The industry trends of the XCV100E-8BGG352C chip model are constantly changing and evolving. As technology advances, the need for more powerful and efficient chips is becoming increasingly apparent. This chip model is well-suited to the demands of modern applications, such as those used in embedded systems, image processing, and digital signal processing.
In terms of future upgrades, the XCV100E-8BGG352C chip model is designed to be flexible and upgradable. It is capable of supporting new technologies and features, as well as being able to be applied to advanced communication systems. As technology advances, the chip model will be able to adapt and evolve to meet the needs of the ever-changing industry.
In conclusion, the XCV100E-8BGG352C chip model is an ideal choice for applications that require high performance and low power consumption. It is designed to meet the demands of modern applications, as well as being capable of supporting new technologies and features. The chip model is also upgradable and can be applied to advanced communication systems. As technology advances, the chip model will be able to evolve to meet the needs of the ever-changing industry.
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|---|---|---|
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