AMD Xilinx
XCV100E-7PQG240I
XCV100E-7PQG240I ECAD Model
XCV100E-7PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV100E-7PQG240I Datasheet Download
XCV100E-7PQG240I Overview
The chip model XCV100E-7PQG240I is a powerful and reliable semiconductor product designed for high-performance computing and networking applications. It is manufactured by Xilinx, a leading provider of programmable logic solutions. It is based on the Virtex-7 family of FPGAs and is designed to meet the most demanding requirements of today’s data center, enterprise, and embedded applications.
In terms of industry trends, the XCV100E-7PQG240I is a powerful and reliable choice for high-performance computing and networking applications. It is designed to meet the needs of today’s data center, enterprise, and embedded applications, and it is expected to remain a popular choice in the near future. The chip is also designed to support the latest technologies, such as PCIe Gen3, DDR3, and QDR-IV SRAM, which are essential for the development of advanced networks, intelligent systems, and embedded applications.
In terms of the chip’s possible future applications, the XCV100E-7PQG240I can be used in a variety of network and intelligent scenarios. It is capable of supporting the latest technologies, such as machine learning, deep learning, and artificial intelligence, which are essential for the development of fully intelligent systems. Additionally, the chip is designed to support the latest networking protocols, such as Ethernet, Wi-Fi, and Bluetooth, which are essential for the development of advanced networks.
In terms of the product description and specific design requirements of the chip model XCV100E-7PQG240I, it is designed with a Virtex-7 FPGA, which is capable of delivering up to 6.6Tbps of bandwidth and up to 4.2Tb/s of memory bandwidth. Additionally, the chip is designed to support a variety of high-speed I/O protocols and to provide an integrated PCI Express Gen3 x16 interface. Furthermore, the chip is designed to support up to four DDR3 memory controllers and up to four QDR-IV SRAM controllers, which are essential for the development of advanced networks and intelligent systems.
In terms of actual case studies and precautions, the XCV100E-7PQG240I has been successfully used in a variety of applications, such as data centers, enterprise networks, and embedded systems. In order to ensure the successful deployment of the chip, it is important to consider the specific requirements of the application, such as the power, cooling, and I/O requirements. Additionally, it is important to consider the current and future trends in the industry, as well as the potential for the chip to be used in the era of fully intelligent systems.
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|---|---|---|
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