AMD Xilinx
XCV100E-6CSG144C
XCV100E-6CSG144C ECAD Model
XCV100E-6CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV100E-6CSG144C Datasheet Download
XCV100E-6CSG144C Overview
The XCV100E-6CSG144C chip model is a cutting-edge integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for engineers and developers to create innovative and advanced products.
The XCV100E-6CSG144C chip model was designed with the intention of providing a comprehensive, high-performance solution for digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks with ease and is equipped with features that make it suitable for use in a variety of applications. The chip model is designed to be easily upgradable, allowing developers to add new features and capabilities to their products as they become available.
The XCV100E-6CSG144C chip model is also suitable for use in advanced communication systems, providing a reliable and efficient solution for data transmission. This makes it an ideal choice for use in a variety of applications, from wireless networks to satellite communications.
The XCV100E-6CSG144C chip model is also suitable for use in the development and popularization of future intelligent robots. It is capable of handling complex tasks and can be programmed to perform a variety of functions, making it an invaluable tool for the development of future robotic systems. To use the XCV100E-6CSG144C chip model effectively, engineers and developers will need to have a good understanding of hardware description language (HDL).
The XCV100E-6CSG144C chip model is a powerful tool for engineers and developers, providing a comprehensive and high-performance solution for digital signal processing, embedded processing, image processing, and advanced communication systems. With the right technical talent and knowledge, it can be used to develop and popularize future intelligent robots, making it an invaluable asset in the development of the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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