AMD Xilinx
XCV100E-6BGG352I
XCV100E-6BGG352I ECAD Model
XCV100E-6BGG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 32400 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 32400 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV100E-6BGG352I Datasheet Download
XCV100E-6BGG352I Overview
The XCV100E-6BGG352I chip model is a powerful and versatile integrated circuit (IC) designed by Xilinx Inc. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It is an FPGA (Field Programmable Gate Array) device, meaning it can be programmed to perform a variety of tasks.
The XCV100E-6BGG352I chip model offers a number of advantages over other ICs. It has a high-performance architecture that can process data at speeds up to 600MHz. It is also capable of using several different types of HDL (Hardware Description Language) to program the chip. This makes it suitable for a wide range of applications. Additionally, it has a low power consumption, making it a cost-effective solution for many applications.
The demand for the XCV100E-6BGG352I chip model is expected to increase in the future, as more applications become available that require its high-performance capabilities. It is also expected to be used in a variety of industries, such as telecommunications, automotive, aerospace, and medical.
The original design intention of the XCV100E-6BGG352I chip model was to provide a powerful and efficient solution for a variety of applications. It was designed to be upgradeable, meaning that new features can be added to the chip as needed. This makes it suitable for use in advanced communication systems, as new features can be added as they become available.
The XCV100E-6BGG352I chip model is a powerful and versatile integrated circuit (IC) that is suitable for a variety of applications. It has a high-performance architecture and is capable of using several different types of HDL to program the chip. It is expected to be in high demand in the future, as more applications become available that require its high-performance capabilities. Additionally, it was designed to be upgradeable, meaning that new features can be added to the chip as needed, making it suitable for use in advanced communication systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $27.3154 | $27.3154 |
| 10+ | $27.0217 | $270.2169 |
| 100+ | $25.5531 | $2,555.3118 |
| 1000+ | $24.0845 | $12,042.2740 |
| 10000+ | $22.0286 | $22,028.5500 |
| The price is for reference only, please refer to the actual quotation! | ||