AMD Xilinx
XCV1000E-8FGG900C
XCV1000E-8FGG900C ECAD Model
XCV1000E-8FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1000E-8FGG900C Datasheet Download
XCV1000E-8FGG900C Overview
The XCV1000E-8FGG900C chip model is a powerful tool for various digital signal processing, embedded processing, and image processing applications. It is an advanced model that requires the use of HDL language, which is a programming language used to describe the behavior of logic circuits. This chip model is an excellent choice for those who need high-performance digital signal processing, embedded processing, and image processing.
The XCV1000E-8FGG900C chip model has several advantages. It is a low power, high-performance device with an integrated FPGA fabric, allowing for a wide range of applications. It also supports multiple high-speed transceivers and memory interfaces, allowing for increased data throughput and improved system performance. Furthermore, this chip model is designed to be compatible with various software development tools, making it easier to develop and debug applications.
The demand for the XCV1000E-8FGG900C chip model is expected to grow in the future, as the need for advanced digital signal processing, embedded processing, and image processing applications increases. This chip model is well-suited for a variety of industries, including automotive, aerospace, medical, and consumer electronics. As the demand for more sophisticated applications increases, the XCV1000E-8FGG900C chip model will become increasingly popular.
The XCV1000E-8FGG900C chip model is also suitable for the development and popularization of future intelligent robots. This chip model can be used to create powerful and sophisticated robots that can perform complex tasks autonomously. The chip model is capable of processing data quickly and accurately, making it well-suited for applications such as self-driving cars, autonomous robots, and intelligent home assistants.
In order to use the XCV1000E-8FGG900C chip model effectively, certain technical talents are required. Those who wish to use this chip model should have a good understanding of HDL language and be familiar with the various software development tools that are compatible with this chip model. Additionally, they should have a good understanding of the various digital signal processing, embedded processing, and image processing applications that this chip model can be used for. With the right skills, the XCV1000E-8FGG900C chip model can be used to create powerful and sophisticated applications.
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4,153 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $691.9200 | $691.9200 |
| 10+ | $684.4800 | $6,844.8000 |
| 100+ | $647.2800 | $64,728.0000 |
| 1000+ | $610.0800 | $305,040.0000 |
| 10000+ | $558.0000 | $558,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||