AMD Xilinx
XCV1000E-8FG900I
XCV1000E-8FG900I ECAD Model
XCV1000E-8FG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-900 | |
| Pin Count | 900 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-8FG900I Datasheet Download
XCV1000E-8FG900I Overview
The XCV1000E-8FG900I chip model is a powerful and versatile tool for the development of advanced communication systems and the popularization of intelligent robots. It is designed to provide a comprehensive set of features that can be used to create powerful and efficient solutions for a wide range of applications.
The XCV1000E-8FG900I chip model is designed to be highly compatible with existing technologies. It is capable of running various operating systems, such as Windows, Linux, and Android. It also supports a wide range of communication protocols, such as Bluetooth, Wi-Fi, and Zigbee. This makes it ideal for use in both home and industrial applications.
The chip model also has a number of advantages over other solutions. It is capable of operating at high speeds, up to 8GHz, and is highly energy efficient. This makes it ideal for use in applications where power consumption is critical, such as in industrial robots. It is also capable of supporting a wide range of features, such as advanced encryption and authentication, as well as a wide range of communication protocols.
The XCV1000E-8FG900I chip model is also designed to be highly upgradable. This allows for future upgrades to be implemented without significant changes to the underlying hardware. This makes it ideal for use in applications where future upgrades are likely, such as in the development of intelligent robots.
The XCV1000E-8FG900I chip model is expected to be in high demand in the future due to its wide range of features and its ability to be used in a variety of applications. As the demand for intelligent robots increases, the XCV1000E-8FG900I chip model is likely to become an increasingly important tool for the development and popularization of these robots.
Using the XCV1000E-8FG900I chip model effectively requires a range of technical skills. These include knowledge of programming languages, such as C++ and Python, as well as a good understanding of communication protocols and encryption. Additionally, knowledge of robotic control systems and artificial intelligence is also necessary.
In conclusion, the XCV1000E-8FG900I chip model is a powerful and versatile tool for the development of advanced communication systems and the popularization of intelligent robots. It is designed to be highly compatible with existing technologies, and is capable of running at high speeds and supporting a wide range of features. It is also highly upgradable, allowing for future upgrades to be implemented without significant changes to the underlying hardware. As such, it is expected to be in high demand in the future, and requires a range of technical skills to use effectively.
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3,434 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $691.9200 | $691.9200 |
| 10+ | $684.4800 | $6,844.8000 |
| 100+ | $647.2800 | $64,728.0000 |
| 1000+ | $610.0800 | $305,040.0000 |
| 10000+ | $558.0000 | $558,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||