AMD Xilinx
XCV1000E-8FG1156I
XCV1000E-8FG1156I ECAD Model
XCV1000E-8FG1156I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000E-8FG1156I Datasheet Download
XCV1000E-8FG1156I Overview
The XCV1000E-8FG1156I chip model is a highly advanced and powerful model that is designed to meet the needs of the most demanding applications. It is a modern, highly efficient, and cost-effective solution for a variety of applications. This chip model is based on the latest technology and is designed to provide maximum performance and reliability. It is designed to meet the needs of the most demanding applications, including those in the automotive, industrial, medical, and communication industries.
The XCV1000E-8FG1156I chip model has many advantages, including its high clock speed, low power consumption, and high performance. It has a wide range of features that make it suitable for a variety of applications, including high-speed data processing, real-time audio/video streaming, and advanced communication systems. The chip model also has an advanced architecture that allows it to be easily upgraded to meet future demands.
The XCV1000E-8FG1156I chip model is designed to meet specific design requirements. It is designed to be highly efficient and reliable, and it is also designed to be highly cost-effective. It is designed to be easy to use and maintain, and it is also designed to be highly compatible with a variety of hardware and software platforms. It is also designed to be highly secure, and it is designed to be able to handle large amounts of data with ease.
The XCV1000E-8FG1156I chip model has been used in a variety of applications, including automotive, industrial, medical, and communication applications. It has been used in a variety of case studies, and it has been proven to be highly reliable and efficient. The chip model is also designed to be highly secure, and it is designed to be able to handle large amounts of data with ease.
When using the XCV1000E-8FG1156I chip model, there are a few precautions that should be taken. It is important to ensure that the chip model is properly installed and configured, and that all of the necessary hardware and software components are properly installed and configured. It is also important to ensure that the chip model is properly maintained and that all of the necessary updates and upgrades are performed.
The XCV1000E-8FG1156I chip model is an advanced and powerful model that is designed to meet the needs of the most demanding applications. It is highly efficient, cost-effective, and reliable, and it is designed to be easy to use and maintain. It is also designed to be highly secure, and it is designed to be able to handle large amounts of data with ease. The chip model is expected to be in high demand in the future, and it is expected to be used in a variety of applications, including automotive, industrial, medical, and communication applications. It is also expected to be easily upgradable to meet the needs of the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||