XCV1000E-8BGG560I
XCV1000E-8BGG560I
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rohs

AMD Xilinx

XCV1000E-8BGG560I


XCV1000E-8BGG560I
F20-XCV1000E-8BGG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA, BGA560,33X33,50
LBGA, BGA560,33X33,50

XCV1000E-8BGG560I ECAD Model


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XCV1000E-8BGG560I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 404
Number of Outputs 404
Number of Logic Cells 27648
Number of Equivalent Gates 331776
Number of CLBs 6144
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 6144 CLBS, 331776 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA560,33X33,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA, BGA560,33X33,50
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV1000E-8BGG560I Datasheet Download


XCV1000E-8BGG560I Overview



The chip model XCV1000E-8BGG560I is a cutting-edge model of the semiconductor industry, and its development has been widely recognized by the industry. It is a highly integrated 8-bit MCU with an embedded 8051 core and a wide range of peripherals. It is widely used in various applications, such as industrial control, home appliances, and automotive electronics.


The industry trends of the XCV1000E-8BGG560I is driven by the need for low power consumption and high performance. This chip model has a low power consumption of less than 1 W, and its high performance is achieved by its powerful computing capabilities, including a wide range of peripherals and its 8051 core. The model is also designed for scalability, allowing for easy upgrades and customization.


The future development of the XCV1000E-8BGG560I and related industries will depend on the specific technologies needed for the application environment. For example, if the application requires the support of new technologies such as artificial intelligence (AI) and machine learning, then the chip model must be able to support these technologies. In addition, the model must also be able to support advanced communication systems, such as 5G networks, in order to be applied in the development and popularization of future intelligent robots.


In order to use the XCV1000E-8BGG560I effectively, it is important to have the right technical talents. These include electrical engineers, computer engineers, and software engineers who are knowledgeable in the relevant technologies. These professionals must also have a good understanding of the chip model, its design and architecture, and its capabilities. They must be able to analyze the application requirements and design a suitable solution for the application.


Overall, the chip model XCV1000E-8BGG560I is a highly integrated 8-bit MCU with a wide range of peripherals and an embedded 8051 core. Its industry trends are driven by the need for low power consumption and high performance, and its future development and related industries will depend on the specific technologies needed for the application environment. In order to use the model effectively, it is important to have the right technical talents and a good understanding of the chip model, its design and architecture, and its capabilities.



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Unit Price: $327.60
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Pricing (USD)

QTY Unit Price Ext Price
1+ $304.6680 $304.6680
10+ $301.3920 $3,013.9200
100+ $285.0120 $28,501.2000
1000+ $268.6320 $134,316.0000
10000+ $245.7000 $245,700.0000
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