AMD Xilinx
XCV1000E-7FGG900I
XCV1000E-7FGG900I ECAD Model
XCV1000E-7FGG900I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV1000E-7FGG900I Datasheet Download
XCV1000E-7FGG900I Overview
The XCV1000E-7FGG900I chip model is a powerful and versatile tool for many applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and more. It requires the use of HDL (Hardware Description Language) for programming and development. The model includes a variety of features and capabilities that make it ideal for a range of applications.
The XCV1000E-7FGG900I model includes a high-performance processor, memory controller, and peripheral controllers. It also includes a variety of interface options, including Ethernet, USB, and SPI. The model is designed to be highly efficient, with a low-power design that allows for maximum performance while consuming minimal power.
The XCV1000E-7FGG900I model is also designed to be easy to use. It includes a comprehensive set of development tools and libraries that make it easy to create and deploy applications. The model also supports a range of programming languages, including C, C++, and HDL. The model also includes a range of debugging and testing tools that make it easy to troubleshoot and optimize applications.
The XCV1000E-7FGG900I model is also highly reliable. It is designed to be robust and reliable, with a solid design that is resistant to external interference. The model also includes a range of safety features that make it suitable for use in a variety of environments.
The XCV1000E-7FGG900I chip model can be used for the development and popularization of future intelligent robots. It is a powerful and versatile tool that can be used to create robots that can perform complex tasks. To use the model effectively, technical talents such as C, C++, and HDL programmers are needed. In addition, those who understand the principles of robotics and artificial intelligence are also needed to effectively utilize the model.
In conclusion, the XCV1000E-7FGG900I chip model is a versatile and powerful tool for many applications. It is designed to be efficient, reliable, and easy to use. It can be used for the development and popularization of future intelligent robots, but technical talents such as C, C++, and HDL programmers are needed to effectively use the model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||