AMD Xilinx
XCV1000E-7FGG900C
XCV1000E-7FGG900C ECAD Model
XCV1000E-7FGG900C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B900 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 900 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA900,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA900,30X30,40 | |
| Pin Count | 900 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1000E-7FGG900C Datasheet Download
XCV1000E-7FGG900C Overview
The XCV1000E-7FGG900C chip model is an advanced communications system that is designed to meet the needs of today's ever-evolving technology landscape. Developed by Xilinx, this chip model is designed to support the latest communication protocols, allowing for superior performance and reliability. This chip model is a high-performance, low-power system that can be used in a variety of applications.
The XCV1000E-7FGG900C chip model was designed to meet the demands of the modern communications industry. It is designed to provide superior performance and low power consumption, while still being able to support the latest communication protocols. This chip model is designed to be used in a variety of applications, including wireless networks, data centers, and other communication systems.
The XCV1000E-7FGG900C chip model is designed to support the latest communication protocols, allowing for superior performance and reliability. It is also designed to be used in a variety of applications, including wireless networks, data centers, and other communication systems. This chip model is also designed to be upgradeable, allowing for future upgrades if needed.
The product description of the XCV1000E-7FGG900C chip model includes its design requirements, such as the number of cores, memory size, and other features. It also includes the expected performance of the chip model, such as the maximum clock speed and power consumption. Additionally, the product description will include any precautions that should be taken when using the chip model, such as avoiding static electricity and other environmental hazards.
In addition to the product description, there are also case studies and other resources that can be used to better understand the XCV1000E-7FGG900C chip model. These case studies will provide examples of how the chip model has been used in various applications and how it can be used in the future. This can be a great resource for anyone looking to understand the capabilities of the XCV1000E-7FGG900C chip model.
When it comes to the industry trends of the XCV1000E-7FGG900C chip model and the future development of related industries, it is important to understand the specific technologies that are needed. This includes understanding the design requirements of the chip model, as well as the expected performance and power consumption. Additionally, it is important to consider whether the application environment requires the support of new technologies, such as 5G or other emerging technologies.
Overall, the XCV1000E-7FGG900C chip model is a high-performance, low-power system that is designed to meet the demands of today's ever-evolving technology landscape. This chip model is designed to support the latest communication protocols, allowing for superior performance and reliability. It is also designed to be upgradeable, allowing for future upgrades if needed. Additionally, the product description, case studies, and other resources can be used to better understand the XCV1000E-7FGG900C chip model. Finally, when it comes to the industry trends and future development of related industries, it is important to understand the specific technologies that are needed.
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