AMD Xilinx
XCV1000E-7FGG1156C
XCV1000E-7FGG1156C ECAD Model
XCV1000E-7FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 660 | |
| Number of Outputs | 660 | |
| Number of Logic Cells | 27648 | |
| Number of Equivalent Gates | 331776 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 331776 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV1000E-7FGG1156C Datasheet Download
XCV1000E-7FGG1156C Overview
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Overall, the chip model XCV1000E-7FGG1156C is a powerful tool for the development of modern technology. It is capable of supporting a variety of intelligent scenarios and can be used in the era of fully intelligent systems. To effectively use the model, it is important to understand the various technologies needed to support its application environment, as well as the development and popularization of future intelligent robots. With the right knowledge and technical talents, the chip model XCV1000E-7FGG1156C can be used to create powerful and innovative solutions for the future.
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|---|---|---|
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