XCV1000-6BG560C

The XCV1000-6BG560C is a high-performance FPGA (Field Programmable Gate Array) chip from Xilinx. It is a member of the Virtex family of FPGAs and is part of the Virtex-6 series. This device is built using the 65nm process technology and has a die size of 596mm2. It is a low-power, high-performance device that can be used in a wide range of applications.

The XCV1000-6BG560C has a total of 1,120,000 logic cells and 28,800 flip-flops. It also has a total of 1,120 DSP slices, 2,240 block RAMs and a total of 4,480 I/O pins. It has a maximum clock frequency of 600MHz and can operate at a temperature range of 0°C to 85°C. It is also equipped with two integrated transceivers, two PCIe hard blocks and two USB 2.0 hard blocks.

This FPGA chip can be used in a wide range of applications, including high-speed networking, video processing, embedded systems, signal processing, and aerospace and defense systems. It can also be used in medical imaging, automotive systems, industrial automation, and communications systems.

In short, the XCV1000-6BG560C is a high-performance, low-power FPGA chip from Xilinx that can be used in a wide range of applications. It has a total of 1,120,000 logic cells, 28,800 flip-flops, 1,120 DSP slices, 2,240 block RAMs, 4,480 I/O pins and a maximum clock frequency of 600MHz. It can be used in high-speed networking, video processing, embedded systems, signal processing, and aerospace and defense systems, as well as medical imaging, automotive systems, industrial automation, and communications systems.