AMD Xilinx
XCV1000-5FGG680I
XCV1000-5FGG680I ECAD Model
XCV1000-5FGG680I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 1124022 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B680 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 680 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 680 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000-5FGG680I Datasheet Download
XCV1000-5FGG680I Overview
The XCV1000-5FGG680I chip model is a high-performance, low-power, cost-effective solution for a wide range of applications. It is designed to provide a reliable and efficient platform for system designers, with a range of features that make it suitable for a variety of applications.
The XCV1000-5FGG680I chip model offers a number of advantages over traditional chips, including a high-speed processing capability, low power consumption, and a small form factor. It is also designed with a robust and reliable architecture, making it suitable for a wide range of applications.
The XCV1000-5FGG680I chip model is expected to be in high demand in the future, as it is suitable for a wide range of applications, including communications, networking, and embedded systems. It is also expected to be used in the Internet of Things (IoT) and other advanced communication systems.
The XCV1000-5FGG680I chip model is designed to be highly customizable and upgradeable, making it suitable for a wide range of applications. It is capable of being upgraded to support the latest technologies, such as 5G networks, and can be used in a variety of scenarios, such as intelligent transportation, smart home, and industrial automation.
The XCV1000-5FGG680I chip model is also suitable for use in the era of fully intelligent systems. It is capable of supporting a wide range of applications, such as machine learning and artificial intelligence, and can be used in a variety of scenarios, such as autonomous driving and robotics.
Overall, the XCV1000-5FGG680I chip model is a highly versatile and reliable solution for a wide range of applications. It is designed to provide a reliable and efficient platform for system designers, and is expected to be in high demand in the future. It is also capable of being upgraded to support the latest technologies, making it suitable for use in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||