AMD Xilinx
XCV1000-4BGG560I
XCV1000-4BGG560I ECAD Model
XCV1000-4BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 1124022 | |
| Number of CLBs | 6144 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6144 CLBS, 1124022 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV1000-4BGG560I Datasheet Download
XCV1000-4BGG560I Overview
The chip model XCV1000-4BGG560I is a versatile and highly capable digital signal processor. It is suitable for applications such as high-performance digital signal processing, embedded processing, and image processing. The use of HDL language is required to utilize the chip model to its fullest potential.
The industry trends of the chip model XCV1000-4BGG560I, and the future development of related industries, are dependent on the specific technologies that are needed. As technology advances, new technologies may be required for the application environment.
The chip model XCV1000-4BGG560I can be applied to the development and popularization of future intelligent robots. To use the model effectively, technical talents are needed to understand the functions of the chip model and utilize them in the application environment. These technical talents should have a strong knowledge of HDL language, as well as a good understanding of the chip model and its features. They should also be familiar with the development of intelligent robots, and the technologies required to create them.
In conclusion, the chip model XCV1000-4BGG560I is a versatile and powerful digital signal processor. It can be used for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. The use of HDL language is required to use the chip model effectively. The industry trends and future development of related industries are dependent on the specific technologies that are needed. The chip model can also be applied to the development and popularization of future intelligent robots, and technical talents are needed to use the model effectively.
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5,195 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,266.3187 | $1,266.3187 |
| 10+ | $1,252.7024 | $12,527.0236 |
| 100+ | $1,184.6207 | $118,462.0710 |
| 1000+ | $1,116.5391 | $558,269.5300 |
| 10000+ | $1,021.2248 | $1,021,224.7500 |
| The price is for reference only, please refer to the actual quotation! | ||