
AMD Xilinx
XCV100-6TQG144I
XCV100-6TQG144I ECAD Model
XCV100-6TQG144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 108904 | |
Number of CLBs | 600 | |
Combinatorial Delay of a CLB-Max | 600 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 600 CLBS, 108904 GATES | |
Clock Frequency-Max | 333 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV100-6TQG144I Datasheet Download
XCV100-6TQG144I Overview
The XCV100-6TQG144I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is suitable for a wide range of applications, such as high-performance computing, multimedia, robotics, and medical imaging.
The chip model has a wide range of potential applications in the future. It could be used to facilitate network performance and enable intelligent scenarios. It could also be used for fully intelligent systems, such as autonomous vehicles and intelligent home systems.
The XCV100-6TQG144I chip model is in line with industry trends and is designed to be used with the most up-to-date technologies. This means that it is not only suitable for current applications, but also for future applications. It is designed to be flexible and scalable, so it can be adapted to new technologies as they become available.
The chip model is also designed to be energy efficient, making it suitable for a wide range of applications. It is also designed to be reliable and secure, so it can be used in mission-critical applications.
The XCV100-6TQG144I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the most up-to-date technologies and is suitable for current and future applications. It is energy efficient, reliable, and secure, making it suitable for a wide range of applications, including networks and intelligent scenarios. With its flexibility and scalability, it can be adapted to new technologies as they become available, making it a great choice for the era of fully intelligent systems.
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