AMD Xilinx
XCV100-6FGG256C
XCV100-6FGG256C ECAD Model
XCV100-6FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-6FGG256C Datasheet Download
XCV100-6FGG256C Overview
The XCV100-6FGG256C is a powerful chip model designed for high-performance digital signal processing, embedded processing, and image processing. This model is especially well suited for applications where the use of an HDL language is required. It has several advantages over other similar models, including a high-speed signal processing capability and a wide range of features.
The XCV100-6FGG256C is an ideal choice for a variety of industries, including telecommunications, automotive, aerospace, and medical. It is expected to remain in high demand in these industries in the future as the need for high-performance digital signal processing increases. Additionally, the model is expected to be used in more network-centric applications, such as network security, packet processing, and traffic control.
The XCV100-6FGG256C is also well suited for use in intelligent systems. It is capable of performing complex tasks, such as facial recognition and object detection, with a high degree of accuracy. This chip is also capable of being used in the era of fully intelligent systems, such as autonomous vehicles and smart homes. The XCV100-6FGG256C is a powerful and versatile chip model that can be used in a variety of applications and industries. Its high-speed signal processing capability, wide range of features, and ability to be used in intelligent systems make it an attractive choice for many businesses and organizations.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||