AMD Xilinx
XCV100-6CSG144C
XCV100-6CSG144C ECAD Model
XCV100-6CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-6CSG144C Datasheet Download
XCV100-6CSG144C Overview
The chip model XCV100-6CSG144C is a powerful and versatile model that has the potential to be used in a variety of applications and industries. It is an important component of the modern digital world and is used in a wide range of devices, from smartphones to computers and other electronics. It is a model that has been designed to meet the needs of a wide range of users, from professionals to hobbyists.
The XCV100-6CSG144C chip model is designed to be used in networks and intelligent scenarios, offering support for a variety of technologies. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, as well as older technologies such as 2G and 3G. It is also capable of supporting a variety of protocols, such as IPv4, IPv6, and TCP/IP.
The chip model XCV100-6CSG144C is also capable of being used in the development and popularization of future intelligent robots. It is capable of supporting a variety of sensors, such as vision, motion, and sound, as well as a variety of actuators, such as motors, servos, and relays. It is also capable of supporting a variety of AI algorithms, such as deep learning and reinforcement learning.
In order to use the chip model XCV100-6CSG144C effectively, it is important to have the right technical talent. Those who are knowledgeable in the fields of networking, robotics, and AI are the best candidates to use the model effectively. They should also have an understanding of the various protocols and technologies that the model supports.
The chip model XCV100-6CSG144C is an important part of the modern digital world and has the potential to be used in a variety of applications and industries. It is capable of supporting the latest technologies and protocols, as well as being used in the development and popularization of future intelligent robots. In order to use the model effectively, it is important to have the right technical talent. With the right expertise, the chip model XCV100-6CSG144C can be used to help create the future of intelligent systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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