XCV100-5BG256C

The XCV100-5BG256C is a Field Programmable Gate Array (FPGA) chip designed and manufactured by Xilinx. It is a 5th Generation Spartan FPGA chip that provides 256K logic cells with a maximum operating frequency of up to 200 MHz. It is a low-cost, low-power and high-performance device that is suitable for a wide range of applications.

The XCV100-5BG256C features a total of 5,000 logic slices, each with four 4-input LUTs, and 16 Kbits of dedicated RAM. It also has a total of 8 DSP slices, each with 18 x 18 multipliers, and a total of 8 Multiplier Accumulator (MAC) units. The chip also features two clock management tiles, two PLLs, two global clock networks, and two global buffer networks.

The XCV100-5BG256C is suitable for a wide range of applications, including wireless communications, networking, embedded systems, image and video processing, and automotive applications. It is designed to provide a high-performance, low-cost solution for these applications.

The XCV100-5BG256C is available in a range of packages, including a 256-pin fine-pitch ball-grid array (BGA) package, and a 256-pin plastic quad flat package (PQFP). It is also available in a range of temperature grades, including commercial grade (0°C to +85°C), industrial grade (-40°C to +85°C), and automotive grade (-40°C to +125°C).