AMD Xilinx
XCV100-4TQG144C
XCV100-4TQG144C ECAD Model
XCV100-4TQG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-4TQG144C Datasheet Download
XCV100-4TQG144C Overview
The XCV100-4TQG144C chip model is a powerful solution for digital signal processing (DSP), embedded processing, and image processing. It is designed with a highly integrated architecture that allows it to be used in a wide range of applications. It is also capable of supporting a variety of HDL languages, allowing for more efficient development and deployment of complex systems.
The XCV100-4TQG144C chip model offers a host of advantages over traditional solutions. It is designed to be extremely power-efficient, with an extremely low power consumption rate. This chip model also offers superior performance and scalability, allowing for more efficient and cost-effective development. Additionally, the chip model has a wide range of features, including an integrated clock generator, high-speed memory, and a wide range of peripherals.
The XCV100-4TQG144C chip model is expected to see an increasing demand in the coming years. With its high performance and scalability, it is well-suited for a wide range of applications, from consumer electronics to industrial automation. Additionally, this chip model is capable of supporting advanced communication systems, making it ideal for use in the Internet of Things (IoT) and other connected systems.
The original design intention of the XCV100-4TQG144C chip model was to create a powerful solution for digital signal processing, embedded processing, and image processing. This chip model is designed to be extremely power-efficient, with an extremely low power consumption rate. Additionally, it offers superior performance and scalability, allowing for more efficient and cost-effective development.
The XCV100-4TQG144C chip model is also capable of future upgrades, allowing it to be used in more advanced systems. This chip model is capable of supporting a wide range of peripherals, including an integrated clock generator, high-speed memory, and a wide range of peripherals. Additionally, it is capable of supporting advanced communication systems, making it ideal for use in the Internet of Things (IoT) and other connected systems.
The XCV100-4TQG144C chip model is an ideal solution for digital signal processing, embedded processing, and image processing. With its high performance and scalability, it is well-suited for a wide range of applications, from consumer electronics to industrial automation. Additionally, this chip model is capable of supporting advanced communication systems, making it ideal for use in the Internet of Things (IoT) and other connected systems. Its original design intention was to create a powerful solution for digital signal processing, embedded processing, and image processing, and it is capable of future upgrades, allowing it to be used in more advanced systems. As such, the XCV100-4TQG144C chip model is expected to see an increasing demand in the coming years.
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