AMD Xilinx
XCV100-4FGG256C
XCV100-4FGG256C ECAD Model
XCV100-4FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-4FGG256C Datasheet Download
XCV100-4FGG256C Overview
The XCV100-4FGG256C chip model is a high-performance, low-power, and multi-functional system-on-chip (SoC) designed for digital signal processing, embedded processing, and image processing. It is built with a combination of Verilog HDL and C language, providing users with a wide range of customization options.
The XCV100-4FGG256C chip model was designed with the intention of creating a powerful and versatile device that could be used in a variety of applications. It has an advanced architecture that enables it to be easily upgraded and expanded, making it suitable for a wide range of applications.
The XCV100-4FGG256C chip model is capable of supporting advanced network applications, such as 5G communications and the Internet of Things (IoT). It can be used in a variety of intelligent scenarios, such as autonomous vehicles, intelligent homes, and smart cities. It is also capable of supporting the development of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML).
The XCV100-4FGG256C chip model is a powerful and versatile device that can be used in a variety of applications. It is designed to be easily upgraded and expanded, making it suitable for a wide range of applications. It is capable of supporting advanced network applications, such as 5G communications and the Internet of Things (IoT). It can also be used in a variety of intelligent scenarios and is capable of supporting the development of fully intelligent systems, such as artificial intelligence (AI) and machine learning (ML).
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2,701 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $69.2812 | $69.2812 |
| 10+ | $68.5362 | $685.3623 |
| 100+ | $64.8114 | $6,481.1433 |
| 1000+ | $61.0866 | $30,543.3190 |
| 10000+ | $55.8719 | $55,871.9250 |
| The price is for reference only, please refer to the actual quotation! | ||