AMD Xilinx
XCV100-4BGG256I
XCV100-4BGG256I ECAD Model
XCV100-4BGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 108904 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 108904 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV100-4BGG256I Datasheet Download
XCV100-4BGG256I Overview
The XCV100-4BGG256I chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, giving engineers the ability to create powerful and efficient designs. It is also designed to be future-proof, allowing for upgrades and modifications to meet the changing needs of the industry.
The XCV100-4BGG256I chip model can be applied to advanced communication systems, making it an ideal choice for networks. It is capable of handling high-speed data transfers, making it an ideal choice for a wide range of applications. It is also capable of being used in intelligent scenarios, making it a great choice for the era of fully intelligent systems.
The XCV100-4BGG256I chip model can be used to create a wide range of applications, from simple data transfer to complex network systems. It is also capable of being used in the era of fully intelligent systems, allowing for the development of powerful and efficient systems. It is capable of handling high-speed data transfers, making it a great choice for a wide range of applications.
The XCV100-4BGG256I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. With its ability to handle high-speed data transfers and its ability to be used in intelligent scenarios, it is an ideal choice for the era of fully intelligent systems. It is designed to be future-proof, allowing for upgrades and modifications to meet the changing needs of the industry. It is an ideal choice for a wide range of applications, making it an ideal choice for networks and intelligent scenarios.
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2,777 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $96.4782 | $96.4782 |
| 10+ | $95.4408 | $954.4080 |
| 100+ | $90.2538 | $9,025.3800 |
| 1000+ | $85.0668 | $42,533.4000 |
| 10000+ | $77.8050 | $77,805.0000 |
| The price is for reference only, please refer to the actual quotation! | ||