XCV100-4BGG256C
XCV100-4BGG256C
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rohs

AMD Xilinx

XCV100-4BGG256C


XCV100-4BGG256C
F20-XCV100-4BGG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV100-4BGG256C ECAD Model


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XCV100-4BGG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 108904
Number of CLBs 600
Combinatorial Delay of a CLB-Max 800 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 600 CLBS, 108904 GATES
Clock Frequency-Max 250 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.55 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 256
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV100-4BGG256C Datasheet Download


XCV100-4BGG256C Overview



The XCV100-4BGG256C chip model is a high-performance, low-power, and cost-effective FPGA device. It is designed to provide high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is suitable for a wide variety of applications, ranging from high-end computing and networking to consumer electronics. It is also used in industrial automation, medical imaging, aerospace and defense, and automotive applications.


The XCV100-4BGG256C chip model is based on the Virtex-4 FPGA architecture, which is optimized for high-performance and low-power operation. It includes four banks of 256Kbits of embedded memory, as well as a variety of I/O options. The device is designed to provide a high level of system integration and flexibility. It is also capable of supporting multiple clock domains, allowing for the implementation of complex designs.


When using the XCV100-4BGG256C chip model, it is important to be familiar with the device’s features and capabilities. This includes understanding the device’s architecture, as well as its design and implementation requirements. The device is programmed using the HDL language, and it is important to understand the language’s syntax and semantics. Additionally, the device requires a certain level of expertise in order to use it effectively.


The XCV100-4BGG256C chip model can be used to develop and popularize future intelligent robots. It can be used to implement various algorithms and functions, such as vision, navigation, and control. The device’s high-performance, low-power, and cost-effective features make it an ideal choice for such applications. In order to use the device effectively, it is important to have a good understanding of the HDL language and the device’s architecture. Additionally, it is important to have a good understanding of the application’s requirements and design considerations.


In conclusion, the XCV100-4BGG256C chip model is an ideal choice for high-performance digital signal processing, embedded processing, and image processing applications. It can also be used to develop and popularize future intelligent robots. In order to use the device effectively, it is important to have a good understanding of the HDL language and the device’s architecture, as well as the application’s requirements and design considerations.



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Unit Price: $87.36
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QTY Unit Price Ext Price
1+ $81.2448 $81.2448
10+ $80.3712 $803.7120
100+ $76.0032 $7,600.3200
1000+ $71.6352 $35,817.6000
10000+ $65.5200 $65,520.0000
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