AMD Xilinx
XCS40XL-3BG256I
XCS40XL-3BG256I ECAD Model
XCS40XL-3BG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 784 CLBS, 13000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS40XL-3BG256I Datasheet Download
XCS40XL-3BG256I Overview
The XCS40XL-3BG256I chip model is a powerful and versatile digital signal processor (DSP) designed to meet the needs of high-performance embedded processing, image processing, and other applications. It is based on the Xilinx Spartan-6 FPGA architecture and is programmed using the HDL language. This chip model offers a wide range of features and benefits, making it an ideal choice for many different applications.
The XCS40XL-3BG256I chip model provides high-performance digital signal processing capabilities, allowing for faster and more efficient processing of data. It is also highly reliable and offers a low power consumption, making it an ideal choice for many applications. Additionally, this chip model offers a wide range of features including high-speed memory access, advanced clock management, and on-chip debugging capabilities.
The XCS40XL-3BG256I chip model is expected to see increasing demand in the future as more applications require the use of high-performance digital signal processing. This is due to its versatility, reliability, and low power consumption. Additionally, the chip model is designed to be easily upgradeable, allowing for future upgrades to meet the changing needs of the industry.
The original design intention of the XCS40XL-3BG256I chip model was to provide a powerful and versatile solution for embedded processing, image processing, and other applications. It is capable of handling a wide range of tasks and is designed to be easily upgradeable. This chip model also offers the potential for use in advanced communication systems, such as wireless networks and data centers.
The XCS40XL-3BG256I chip model is an ideal choice for many applications due to its versatility, reliability, and low power consumption. It is designed to be easily upgradeable to meet the changing needs of the industry and can be used in advanced communication systems. With its wide range of features and benefits, this chip model is expected to see increasing demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||