AMD Xilinx
XCS40XL-3BG256C
XCS40XL-3BG256C ECAD Model
XCS40XL-3BG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 205 | |
| Number of Outputs | 205 | |
| Number of Logic Cells | 784 | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 784 CLBS, 13000 GATES | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,20X20,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.55 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCS40XL-3BG256C Datasheet Download
XCS40XL-3BG256C Overview
The XCS40XL-3BG256C chip model is a powerful and versatile model that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and more, and it requires the use of HDL language. This model has a number of advantages that make it an ideal choice for many applications.
One of the main advantages of the XCS40XL-3BG256C chip model is its high performance. It is designed to offer high speed, low power consumption, and low latency. This makes it an ideal choice for applications where performance is essential. Additionally, the model is designed for scalability, allowing for future upgrades to be made to keep up with the demands of the applications.
The XCS40XL-3BG256C chip model also offers a number of other benefits. It is designed with advanced communication systems in mind, allowing for the possibility of future upgrades and applications. Additionally, it is designed to be cost-effective, making it an attractive choice for those looking to save money on their applications.
In the future, the demand for the XCS40XL-3BG256C chip model is expected to increase as more applications and technologies require its use. Its high performance and scalability make it an ideal choice for a variety of applications, from digital signal processing to embedded processing to image processing. Additionally, its cost-effectiveness makes it an attractive choice for those looking to save money on their applications.
The XCS40XL-3BG256C chip model is a powerful and versatile model that is suitable for a variety of applications. Its high performance, scalability, and cost-effectiveness make it an attractive choice for those looking for a powerful and reliable chip model. Additionally, its design allows for the possibility of future upgrades and applications. As the demand for high-performance digital signal processing, embedded processing, and image processing increases, the XCS40XL-3BG256C chip model is an ideal choice for those looking for a cost-effective and reliable solution.
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2,171 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $29.7600 | $29.7600 |
| 10+ | $29.4400 | $294.4000 |
| 100+ | $27.8400 | $2,784.0000 |
| 1000+ | $26.2400 | $13,120.0000 |
| 10000+ | $24.0000 | $24,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||