AMD Xilinx
XCS40-3PQG208C
XCS40-3PQG208C ECAD Model
XCS40-3PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Equivalent Gates | 13000 | |
| Number of CLBs | 784 | |
| Combinatorial Delay of a CLB-Max | 1.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 784 CLBS, 13000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 40000 | |
| Clock Frequency-Max | 125 MHz | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 208 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS40-3PQG208C Datasheet Download
XCS40-3PQG208C Overview
The XCS40-3PQG208C chip model is a high-performance, low-power integrated circuit designed for use in embedded digital signal processing, embedded processing, and image processing. This chip model is designed to be used with the HDL language, and it is capable of meeting the needs of various high-performance applications.
The XCS40-3PQG208C chip model is an ideal choice for embedded designs that require efficient and reliable performance. It is capable of processing large amounts of data quickly, and it is also capable of reducing power consumption. This chip model is also suitable for applications that require high-speed data transfer rates and low latency.
The XCS40-3PQG208C chip model is compatible with a wide range of industry trends, including the Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML). It is also compatible with the latest technologies, such as 5G cellular networks, Wi-Fi 6, and Bluetooth 5.0. This chip model is designed to be used with the latest technologies and can be used in a variety of applications.
When designing with the XCS40-3PQG208C chip model, it is important to consider the specific design requirements of the application. It is also important to consider the actual case studies and precautions related to the chip model. It is essential to understand the features of the chip model and the design requirements of the application in order to ensure that the design is successful.
In conclusion, the XCS40-3PQG208C chip model is an ideal choice for embedded designs that require efficient and reliable performance. It is compatible with a wide range of industry trends and the latest technologies, and it is capable of meeting the needs of various high-performance applications. When designing with this chip model, it is important to consider the specific design requirements of the application, as well as the actual case studies and precautions related to the chip model.
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1,584 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $35.7120 | $35.7120 |
| 10+ | $35.3280 | $353.2800 |
| 100+ | $33.4080 | $3,340.8000 |
| 1000+ | $31.4880 | $15,744.0000 |
| 10000+ | $28.8000 | $28,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||