
AMD Xilinx
XCS30XL-5VQG100C
XCS30XL-5VQG100C ECAD Model
XCS30XL-5VQG100C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Inputs | 77 | |
Number of Outputs | 77 | |
Number of Logic Cells | 1368 | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Combinatorial Delay of a CLB-Max | 1 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 576 CLBS, 10000 GATES | |
Additional Feature | MAXIMUM USABLE GATES 30000 | |
Clock Frequency-Max | 250 MHz | |
Power Supplies | 3.3 V | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP100,.63SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | TFQFP, TQFP100,.63SQ | |
Pin Count | 100 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCS30XL-5VQG100C Datasheet Download
XCS30XL-5VQG100C Overview
The chip model XCS30XL-5VQG100C is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language used to program the chip. This chip model has many potential applications in the field of networks and intelligent systems.
In terms of networks, the XCS30XL-5VQG100C can be used to create powerful and secure networks that are capable of handling high-bandwidth applications. It can also be used to develop more efficient and secure routers and switches. The chip can also be used to create advanced network management systems, enabling users to manage and monitor their networks more effectively.
In terms of intelligent systems, the XCS30XL-5VQG100C can be used to develop and implement various intelligent scenarios. It can be used to create powerful AI-based systems that can be used to solve complex problems. It can also be used to develop advanced robotics systems, which can be used to automate various processes. Furthermore, the chip can be used to create systems that are capable of learning and adapting to changing environments.
The XCS30XL-5VQG100C can also be used to develop and popularize future intelligent robots. The chip can be used to create robots that are capable of performing complex tasks and interacting with humans. It can also be used to create robots that are capable of learning from their environment and adapting to changing conditions.
To effectively use the XCS30XL-5VQG100C, technical talents such as engineers, programmers, and designers are needed. Engineers need to be familiar with the chip's architecture and design, as well as its programming language. Programmers need to be able to write code that is optimized for the chip's architecture and design. Designers need to be able to create user interfaces that are intuitive and easy to use.
In conclusion, the chip model XCS30XL-5VQG100C is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It has potential applications in the field of networks and intelligent systems, and can be used to develop and popularize future intelligent robots. To effectively use the chip model, technical talents such as engineers, programmers, and designers are needed.
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