AMD Xilinx
XCS30XL-5PQG208C
XCS30XL-5PQG208C ECAD Model
XCS30XL-5PQG208C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 169 | |
| Number of Outputs | 169 | |
| Number of Logic Cells | 1368 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Combinatorial Delay of a CLB-Max | 1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES 30000 | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G208 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 208 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP208,1.2SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 28 mm | |
| Length | 28 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-208 | |
| Pin Count | 208 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCS30XL-5PQG208C Datasheet Download
XCS30XL-5PQG208C Overview
The chip model XCS30XL-5PQG208C is a powerful new microchip that promises to revolutionize the way networks and intelligent systems operate. It is designed to provide flexibility, scalability, and performance in a single package, enabling it to be used in a wide variety of applications.
The model XCS30XL-5PQG208C is designed to be used in networks and intelligent systems, and it can be used to build powerful, reliable, and secure systems. It is capable of providing high-speed data processing and communication, as well as advanced analytics and machine learning capabilities. It is also designed to be compatible with a variety of operating systems, making it ideal for use in a variety of scenarios.
The chip model XCS30XL-5PQG208C has a wide range of potential applications in the field of intelligent systems. It can be used to create autonomous robots, intelligent networks, and smart home systems. It can also be used to develop virtual assistants and intelligent agents that can interact with users and provide useful information. In addition, it can be used to develop intelligent systems that can monitor and control various aspects of a network or system, such as energy usage, security, and data management.
The chip model XCS30XL-5PQG208C is also ideal for use in the era of fully intelligent systems. It can be used to develop and deploy intelligent systems that can interact with users and respond to their requests in real-time. It is also capable of providing a secure and reliable platform for the development of artificial intelligence and machine learning applications.
In order to use the chip model XCS30XL-5PQG208C effectively, there are certain technical skills and knowledge that are required. It is important to have a good understanding of the hardware and software components of the chip, as well as the knowledge of programming languages and operating systems. In addition, it is also important to have a good understanding of the principles of artificial intelligence and machine learning, as well as the skills needed to develop and deploy intelligent systems.
The chip model XCS30XL-5PQG208C is a powerful tool that can be used to develop and deploy intelligent systems in a wide variety of scenarios. It is capable of providing a secure and reliable platform for the development and deployment of artificial intelligence and machine learning applications, as well as providing high-speed data processing and communication capabilities. With the right technical skills and knowledge, it is possible to use the chip model XCS30XL-5PQG208C to develop and deploy intelligent systems that can interact with users and provide useful information. It is also possible to use the chip model XCS30XL-5PQG208C in the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||