
AMD Xilinx
XCS30XL-3VQ100I
XCS30XL-3VQ100I ECAD Model
XCS30XL-3VQ100I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 3.3 V | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 576 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Organization | 576 CLBS, 10000 GATES | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
JESD-30 Code | S-PQFP-G100 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 100 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 14 mm | |
Length | 14 mm | |
Seated Height-Max | 1.2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | PLASTIC, VQFP-100 | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCS30XL-3VQ100I Datasheet Download
XCS30XL-3VQ100I Overview
The chip model XCS30XL-3VQ100I is a cutting-edge semiconductor product that has revolutionized the industry. Developed by Xilinx, a leading provider of programmable logic devices, the XCS30XL-3VQ100I is an advanced FPGA (Field Programmable Gate Array) that offers unprecedented performance and flexibility. It is designed to provide a highly efficient, low-cost solution for complex data processing and control applications.
The XCS30XL-3VQ100I is a powerful and versatile chip model that offers a wide range of features and capabilities. It is capable of supporting a variety of data processing tasks, including high-speed memory access, data processing, and communication. It also supports a range of advanced features, such as dynamic reconfiguration, clock synchronization, and on-chip debugging. The chip model also provides excellent power efficiency, making it suitable for applications in a variety of power-sensitive environments.
In terms of industry trends, the XCS30XL-3VQ100I is expected to remain a popular chip model in the future. It is likely to be used in a variety of industries, including communications, automotive, industrial, and consumer electronics. As the demand for more efficient and cost-effective solutions continues to grow, the XCS30XL-3VQ100I is expected to remain an attractive option for businesses.
The XCS30XL-3VQ100I is also likely to be used in a variety of networks, including 5G, IoT, and AI. It is expected to be used in a variety of intelligent scenarios, such as autonomous driving, smart homes, and smart cities. It is also likely to be used in the era of fully intelligent systems, such as the Internet of Things (IoT), where it can be used to enable the development of intelligent applications.
In terms of future development, the XCS30XL-3VQ100I is likely to require the support of new technologies in order to meet the ever-evolving requirements of its application environment. These technologies may include advanced algorithms, artificial intelligence, and machine learning. As the demand for more powerful and efficient solutions increases, so too will the need for the XCS30XL-3VQ100I to be supported by new technologies.
In conclusion, the XCS30XL-3VQ100I is a cutting-edge chip model that offers a wide range of features and capabilities. It is expected to remain a popular choice in the future, with its use likely to extend to a variety of industries and networks. It is also expected to be used in the era of fully intelligent systems, which will require the support of new technologies in order to meet the ever-evolving requirements of its application environment.
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