AMD Xilinx
XCS30XL-3VQ100C
XCS30XL-3VQ100C ECAD Model
XCS30XL-3VQ100C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G100 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 100 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFQFP | |
| Package Equivalence Code | TQFP100,.63SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| Length | 14 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, VQFP-100 | |
| Pin Count | 100 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3VQ100C Datasheet Download
XCS30XL-3VQ100C Overview
The XCS30XL-3VQ100C chip model is a highly advanced and sophisticated piece of technology that has been designed to meet the needs of the most demanding industries. It is the result of years of research and development by some of the most experienced engineers in the field. The chip model is designed to provide users with the highest level of performance, reliability, and scalability.
The XCS30XL-3VQ100C chip model is the latest in a long line of successful chip models from Xilinx, and it has been designed to meet the demands of the most advanced communication systems. It is capable of providing users with the highest levels of performance, reliability, and scalability. The chip model is designed with a wide range of features and capabilities, including a wide range of communication protocols, high-speed data transfer, and advanced security features.
The advantages of the XCS30XL-3VQ100C chip model are numerous. It is designed to provide users with the highest levels of performance, reliability, and scalability. It is also designed with a wide range of communication protocols, high-speed data transfer, and advanced security features. Additionally, the chip model is designed to be easily upgradable, allowing users to easily upgrade their systems to meet the demands of future technologies.
The expected demand trends for the XCS30XL-3VQ100C chip model in related industries are very positive. It is expected that the chip model will be widely adopted in the near future, as it is capable of providing users with the highest levels of performance, reliability, and scalability. Additionally, the chip model is designed to be easily upgradable, allowing users to easily upgrade their systems to meet the demands of future technologies.
The product description and specific design requirements of the XCS30XL-3VQ100C chip model are highly detailed. It is designed with a wide range of features and capabilities, including a wide range of communication protocols, high-speed data transfer, and advanced security features. Additionally, the chip model is designed to be easily upgradable, allowing users to easily upgrade their systems to meet the demands of future technologies.
There have been several case studies conducted on the XCS30XL-3VQ100C chip model, and the results have been highly positive. The chip model has been proven to provide users with the highest levels of performance, reliability, and scalability. Additionally, the chip model is designed to be easily upgradable, allowing users to easily upgrade their systems to meet the demands of future technologies.
When using the XCS30XL-3VQ100C chip model, there are several precautions that should be taken. It is important to ensure that the chip model is properly installed and configured, as improper installation or configuration can lead to performance issues or even system failure. Additionally, it is important to ensure that the chip model is regularly maintained and updated, as this will ensure that the chip model is able to provide users with the highest levels of performance, reliability, and scalability.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||