AMD Xilinx
XCS30XL-3PQ240I
XCS30XL-3PQ240I ECAD Model
XCS30XL-3PQ240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 576 CLBS, 10000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3PQ240I Datasheet Download
XCS30XL-3PQ240I Overview
The chip model XCS30XL-3PQ240I is a product of the latest generation of semiconductor technology, designed to meet the needs of modern communication systems. It is a highly integrated device that combines a wide range of features and functions, including high speed, low power consumption, and high performance. Its high level of integration allows for the development of complex communication systems with reduced design time and cost.
The XCS30XL-3PQ240I is a high-performance, low-power, programmable logic device with a wide range of features and functions. It includes an array of logic elements, multiplexers, flip-flops, and other logic blocks. The device is designed to support a variety of communication protocols, including Ethernet, USB, and Bluetooth. It also supports multiple data transfer rates and can be used to develop advanced communication systems with a wide range of applications.
The chip model XCS30XL-3PQ240I is designed to be highly reliable and efficient. It is capable of operating at temperatures ranging from -40°C to +85°C, and its low power consumption allows for extended operation without the need for additional cooling. Its reliability is further enhanced by its robust design, which includes built-in self-test and fault-tolerant features.
As the industry trends towards the development of more advanced communication systems, the chip model XCS30XL-3PQ240I is well-suited for use in a wide range of applications. It is capable of supporting the latest technologies, such as 5G, Wi-Fi 6, and Bluetooth 5.0, as well as other emerging technologies. Its flexibility and scalability make it an ideal choice for applications that require high performance and low power consumption.
To ensure that the XCS30XL-3PQ240I is used in the most efficient manner, it is important to consider the specific design requirements of the application. For example, the device must be programmed to meet the specific requirements of the application, such as the data transfer rate, protocol, and other communication parameters. It is also important to consider the actual case studies and potential issues that may arise when using the device.
In conclusion, the XCS30XL-3PQ240I is a highly advanced and reliable chip model that is well-suited for use in advanced communication systems. Its high level of integration, flexibility, and scalability make it an ideal choice for a wide range of applications. However, it is important to consider the specific design requirements of the application, as well as actual case studies and potential issues that may arise when using the device.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||