AMD Xilinx
XCS30XL-3PQ240C
XCS30XL-3PQ240C ECAD Model
XCS30XL-3PQ240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 576 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 576 CLBS, 10000 GATES | |
| Power Supplies | 3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3PQ240C Datasheet Download
XCS30XL-3PQ240C Overview
The chip model XCS30XL-3PQ240C is a powerful and reliable chip model that has been widely used in the industry for many years. It has been adopted by many leading companies and is known for its excellent performance and stability. As the technology and industry trends continue to evolve, the XCS30XL-3PQ240C chip model has also been upgraded and improved to keep up with the changing times.
The XCS30XL-3PQ240C chip model is designed for a wide range of applications, ranging from communication systems to intelligent robots. It is capable of providing high-speed data transfer, low-power consumption, and highly reliable performance. It also supports a wide range of communication protocols, making it suitable for a variety of applications.
In terms of the industry trends of the XCS30XL-3PQ240C chip model, it is expected that the demand for the model will continue to grow as more companies adopt it for their applications. Furthermore, the chip model can be upgraded and improved to meet the changing needs of the industry. This means that the chip model can be used in the development and popularization of future intelligent robots, as well as in advanced communication systems.
In order to use the XCS30XL-3PQ240C chip model effectively, it is important to have the right technical talents. This includes software engineers, hardware engineers, and system engineers who are knowledgeable about the chip model and its capabilities. They should also be familiar with the communication protocols and other technologies that are needed to use the chip model effectively.
In conclusion, the XCS30XL-3PQ240C chip model is a powerful and reliable chip model that has been widely used in the industry for many years. Its industry trends are expected to continue to grow, and it can be upgraded and improved to meet the changing needs of the industry. Furthermore, the chip model can be used in the development and popularization of future intelligent robots, as well as in advanced communication systems. To use the chip model effectively, it is important to have the right technical talents who are knowledgeable about the chip model and its capabilities.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||