AMD Xilinx
XCS30XL-3BG256I
XCS30XL-3BG256I ECAD Model
XCS30XL-3BG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 576 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Organization | 576 CLBS, 10000 GATES | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCS30XL-3BG256I Datasheet Download
XCS30XL-3BG256I Overview
The chip model XCS30XL-3BG256I is a high-performance and versatile solution for digital signal processing, embedded processing, and image processing. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is a cost-effective solution for these applications, providing users with excellent performance and reliability.
The chip model XCS30XL-3BG256I offers a wide range of features and capabilities that make it ideal for high-performance digital signal processing and embedded processing applications. It has a high-speed processor core, powerful memory, and advanced I/O interfaces. It also has a wide range of features that enable it to handle complex algorithms and data processing tasks. The chip model XCS30XL-3BG256I also has a low-power consumption design, making it suitable for battery-powered applications.
The chip model XCS30XL-3BG256I is expected to become increasingly popular in related industries in the future. Its performance, flexibility, and scalability make it an attractive solution for a variety of applications. It is also suitable for advanced communication systems, providing users with reliable and efficient communication solutions.
The original design intention of the chip model XCS30XL-3BG256I is to provide a cost-effective solution for high-performance digital signal processing, embedded processing, and image processing applications. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is a cost-effective solution for these applications, providing users with excellent performance and reliability.
The chip model XCS30XL-3BG256I has the potential to be upgraded in the future. It is designed with an open architecture, allowing for flexibility and scalability. This allows users to customize the chip model XCS30XL-3BG256I to their specific needs and requirements. Additionally, the chip model XCS30XL-3BG256I can be applied to advanced communication systems, providing users with reliable and efficient communication solutions.
Overall, the chip model XCS30XL-3BG256I is a powerful and versatile solution for digital signal processing, embedded processing, and image processing applications. It is designed with HDL language, which is a powerful and reliable language and is widely used in the semiconductor industry. The chip model XCS30XL-3BG256I is expected to become increasingly popular in related industries in the future, and its potential for future upgrades and application to advanced communication systems make it an attractive solution for a variety of applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||